TSM-DS3_TDS
TSM-DS3 is a high-performance microwave and RF laminate material, designed specifically for high-frequency applications requiring low signal loss and stable dielectric properties. This material is widely used in communication systems, automotive electronics, and other industries that demand precise and reliable signal transmission. TSM-DS3 offers excellent thermal stability, low moisture absorption, and high mechanical strength, making it suitable for demanding environments.
Key Features and Benefits
- Low Loss and High Performance
- TSM-DS3 provides a low dissipation factor (Df), ensuring minimal signal loss, making it ideal for high-frequency signal processing.
- Stable Dielectric Constant (Dk)
- The material maintains a stable Dk over a wide frequency range, which ensures consistent performance in diverse RF applications, such as antenna designs, amplifiers, and filters.
- Thermal and Mechanical Stability
- TSM-DS3 exhibits excellent thermal stability, able to operate in high-temperature environments without performance degradation. Its high mechanical strength ensures durability, even in harsh conditions.
- Low Moisture Absorption
- The material’s low moisture absorption ensures that its dielectric properties are unaffected by environmental conditions, contributing to long-term performance stability.
- Ease of Fabrication
- TSM-DS3 is compatible with conventional PCB fabrication techniques such as drilling, etching, and lamination, making it an easy material to incorporate into high-frequency circuit designs.
Applications
- Telecommunication Systems
- Used in the construction of communication systems such as base stations, antennas, and RF filters where minimal signal loss is crucial.
- Automotive Electronics
- Ideal for RF circuits in automotive radar systems, infotainment systems, and vehicle communications.
- Microwave and RF Circuits
- Utilized in microwave amplifiers, filters, and other RF circuits requiring precise signal handling.
- Aerospace and Defense
- Well-suited for aerospace, military, and defense applications where high performance, stability, and reliability are critical.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.2 ± 0.05 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.003 (10 GHz) |
| Thermal Conductivity | 0.35 W/m·K |
| Moisture Absorption | < 0.05% |
| Coefficient of Thermal Expansion (CTE), Z-Axis | ~45 ppm/°C |
| Peel Strength (1 oz copper) | ≥ 6 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Operating Temperature Range | -40°C to +105°C |
Fabrication Guidelines
- Drilling
- Use carbide drill bits for clean hole formation. For fine-pitch components, precision drilling should be used to ensure the holes are clean and free of burrs.
- Lamination
- Follow proper lamination protocols, ensuring that temperature and pressure are carefully controlled to avoid issues such as delamination or inadequate bonding.
- Plating and Etching
- TSM-DS3 can be plated using standard PCB electroplating or electroless plating processes. Ensure proper etching processes are followed for trace definition.
- Routing and Cutting
- Standard PCB routers are suitable for cutting the material. Use sharp, clean cutting tools to avoid damage to the laminate and to ensure precise trace definition.
Compliance and Certifications
- RoHS Compliant
- REACH Compliant
- UL 94 V-0 Flammability Rating
TSM-DS3 is a high-performance laminate material that is well-suited for a variety of high-frequency, microwave, and RF circuit applications. With its low dissipation factor, stable dielectric constant, and excellent thermal and mechanical properties, it offers reliability and precision for demanding RF and microwave designs in telecommunication, automotive, aerospace, and defense industries. TSM-DS3 is easy to fabricate and can be used in traditional PCB manufacturing processes, making it a versatile and efficient solution for high-performance designs.
