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PCB Material Specification Sheet
ROGERS

TMM Thermoset Laminate Data Sheet TMM3 – TMM4 – TMM6 – TMM10 – TMM10i – TMM13i

TMM® thermoset laminates are high-performance materials designed for RF and microwave applications requiring excellent thermal and electrical stability. These materials offer a range of dielectric constants, low dissipation factors, and superior mechanical and thermal properties.

Material Options and Specifications

GradeDielectric Constant (Dk)Loss Tangent (Df)Thermal Conductivity (W/m·K)Moisture Absorption (%)Flammability
TMM33.27 ± 0.030.00200.70< 0.10UL 94 V-0
TMM44.50 ± 0.050.00200.70< 0.10UL 94 V-0
TMM66.00 ± 0.100.00230.70< 0.10UL 94 V-0
TMM109.20 ± 0.200.00200.72< 0.10UL 94 V-0
TMM10i9.80 ± 0.200.00180.72< 0.10UL 94 V-0
TMM13i12.90 ± 0.200.00170.79< 0.10UL 94 V-0

Key Features

  1. Electrical Stability:
    • Nearly isotropic dielectric constant across temperature and frequency ranges.
    • Minimal drift over time and environmental exposure.
  2. Thermal Management:
    • High thermal conductivity for superior heat dissipation.
    • Low Coefficient of Thermal Expansion (CTE) matches copper for robust reliability.
  3. Mechanical Strength:
    • High peel strength for copper cladding.
    • Excellent dimensional stability for precise circuit designs.
  4. Environmental Resistance:
    • Low moisture absorption ensures stable performance in humid conditions.
    • UL 94 V-0 flammability rating for safety compliance.

Applications

  • Aerospace and Defense: Radar systems, satellite communications.
  • Telecommunications: RF filters, base station antennas.
  • Automotive: Advanced driver-assistance systems (ADAS), collision avoidance radar.
  • Medical Devices: MRI coils, RF ablation systems.

Mechanical Properties

PropertyTypical Value
Density~2.2 g/cm³
CTE (Z-Axis)30-50 ppm/°C
Tensile Strength>6,000 psi
Copper Peel Strength≥9 lbs/in (1 oz copper)

Processing Guidelines

  1. Drilling:
    • Use carbide or diamond-coated drill bits for reduced burr formation.
    • Ensure proper cooling and chip evacuation.
  2. Lamination:
    • Press temperatures between 220-230°C and uniform pressure application.
  3. Metallization:
    • Suitable for standard electroless and electrolytic plating processes.
  4. Storage:
    • Store in a cool, dry environment. Avoid direct exposure to sunlight or moisture.

Compliance and Certifications

  • RoHS compliant.
  • REACH compliant.
  • Low outgassing certified for aerospace applications.

Author

Eleanor

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