TMM Thermoset Laminate Data Sheet TMM3 – TMM4 – TMM6 – TMM10 – TMM10i – TMM13i
TMM® thermoset laminates are high-performance materials designed for RF and microwave applications requiring excellent thermal and electrical stability. These materials offer a range of dielectric constants, low dissipation factors, and superior mechanical and thermal properties.
Material Options and Specifications
| Grade | Dielectric Constant (Dk) | Loss Tangent (Df) | Thermal Conductivity (W/m·K) | Moisture Absorption (%) | Flammability |
|---|---|---|---|---|---|
| TMM3 | 3.27 ± 0.03 | 0.0020 | 0.70 | < 0.10 | UL 94 V-0 |
| TMM4 | 4.50 ± 0.05 | 0.0020 | 0.70 | < 0.10 | UL 94 V-0 |
| TMM6 | 6.00 ± 0.10 | 0.0023 | 0.70 | < 0.10 | UL 94 V-0 |
| TMM10 | 9.20 ± 0.20 | 0.0020 | 0.72 | < 0.10 | UL 94 V-0 |
| TMM10i | 9.80 ± 0.20 | 0.0018 | 0.72 | < 0.10 | UL 94 V-0 |
| TMM13i | 12.90 ± 0.20 | 0.0017 | 0.79 | < 0.10 | UL 94 V-0 |
Key Features
- Electrical Stability:
- Nearly isotropic dielectric constant across temperature and frequency ranges.
- Minimal drift over time and environmental exposure.
- Thermal Management:
- High thermal conductivity for superior heat dissipation.
- Low Coefficient of Thermal Expansion (CTE) matches copper for robust reliability.
- Mechanical Strength:
- High peel strength for copper cladding.
- Excellent dimensional stability for precise circuit designs.
- Environmental Resistance:
- Low moisture absorption ensures stable performance in humid conditions.
- UL 94 V-0 flammability rating for safety compliance.
Applications
- Aerospace and Defense: Radar systems, satellite communications.
- Telecommunications: RF filters, base station antennas.
- Automotive: Advanced driver-assistance systems (ADAS), collision avoidance radar.
- Medical Devices: MRI coils, RF ablation systems.
Mechanical Properties
| Property | Typical Value |
|---|---|
| Density | ~2.2 g/cm³ |
| CTE (Z-Axis) | 30-50 ppm/°C |
| Tensile Strength | >6,000 psi |
| Copper Peel Strength | ≥9 lbs/in (1 oz copper) |
Processing Guidelines
- Drilling:
- Use carbide or diamond-coated drill bits for reduced burr formation.
- Ensure proper cooling and chip evacuation.
- Lamination:
- Press temperatures between 220-230°C and uniform pressure application.
- Metallization:
- Suitable for standard electroless and electrolytic plating processes.
- Storage:
- Store in a cool, dry environment. Avoid direct exposure to sunlight or moisture.
Compliance and Certifications
- RoHS compliant.
- REACH compliant.
- Low outgassing certified for aerospace applications.
