TLY-5A_TDS
TLY-5A is a high-performance RF laminate that provides low loss, stable dielectric properties, and excellent thermal stability, making it ideal for a wide range of microwave and RF circuit applications. This material is optimized for high-frequency designs, offering superior electrical performance and ease of processing in demanding environments.
Key Features and Benefits
- Low Loss and High Performance
- TLY-5A exhibits low dissipation factor (Df), ensuring minimal signal loss and high performance in RF and microwave applications. It is ideal for circuits requiring high signal integrity.
- Stable Dielectric Constant (Dk)
- TLY-5A maintains a stable Dk over a broad frequency range, ensuring consistent performance in applications such as high-speed communication systems and other RF components.
- Thermal and Mechanical Durability
- The material has excellent thermal stability, which makes it suitable for applications in high-temperature environments. Its mechanical properties remain stable under stress, providing long-term durability.
- Ease of Fabrication
- TLY-5A can be easily processed using standard PCB manufacturing techniques, such as drilling, etching, and plating, making it a convenient choice for designers.
Applications
- High-Frequency Circuit Boards
- Suitable for a variety of RF and microwave applications, including filters, amplifiers, and signal processors.
- Telecommunication Equipment
- Used in mobile communication devices, antennas, and satellite communication systems.
- Automotive and Aerospace
- Ideal for high-reliability applications in aerospace, automotive, and military systems.
- Medical Devices
- TLY-5A is also suitable for use in medical equipment where high-frequency circuit boards are required.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.0 ± 0.05 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.003 (10 GHz) |
| Thermal Conductivity | 0.6 W/m·K |
| Moisture Absorption | < 0.05% |
| Coefficient of Thermal Expansion (CTE), Z-Axis | ~50 ppm/°C |
| Peel Strength (1 oz copper) | ≥ 6 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Operating Temperature Range | -40°C to +105°C |
Fabrication Guidelines
- Drilling:
- Use carbide drill bits for accurate hole formation. Clean holes to avoid any potential issues with plating or trace bonding.
- Lamination:
- Lamination should be done under controlled pressure and temperature to achieve optimal bonding. Proper curing is necessary to avoid delamination.
- Plating and Etching:
- TLY-5A supports conventional plating techniques such as electroplating and electroless plating. Etching should be done using standard methods, with attention to fine trace resolution.
- Routing and Cutting:
- Standard PCB routers and cutting tools can be used to shape TLY-5A boards. Ensure that routers are calibrated to maintain accuracy and avoid chipping.
Compliance and Certifications
- RoHS Compliant
- REACH Compliant
- UL 94 V-0 Flammability Rating
TLY-5A is a high-performance RF laminate ideal for applications that require excellent signal integrity, thermal stability, and mechanical durability. With its low loss and stable dielectric properties, it is a suitable choice for designers seeking a reliable material for high-frequency circuit applications across various industries such as telecommunications, aerospace, and medical devices.
