TLC-32 Low-Cost RF Substrate
TLC-32 is a cost-effective RF substrate designed to meet the needs of high-frequency and microwave applications. It provides a balanced solution for applications that require reasonable performance at a lower cost. TLC-32 is suitable for various RF and microwave devices, including antennas, filters, and circuits, where a balance between cost and performance is crucial.
Key Features and Benefits
- Low-Cost Solution
- Affordable compared to high-performance materials while still offering stable performance for many RF applications.
- Stable Electrical Properties
- Provides consistent dielectric constant and low dissipation factor for reliable signal integrity.
- Easy to Process
- Compatible with standard PCB manufacturing processes, including drilling, etching, and plating, making it easy to integrate into production lines.
- High Thermal Stability
- Suitable for environments where moderate thermal performance is required.
- Mechanical Robustness
- Strong mechanical properties allow for durable and long-lasting PCB designs.
Applications
- Wireless Communication:
- Mobile devices, Wi-Fi, Bluetooth, and other short-range communication systems.
- Antenna Designs:
- Low-cost antennas for general wireless applications.
- RF Circuit Boards:
- Use in applications requiring RF signal processing such as amplifiers, filters, and mixers.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.0 ± 0.1 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.003 (10 GHz) |
| Thermal Conductivity | 0.3 W/m·K |
| Moisture Absorption | < 0.1% |
| Coefficient of Thermal Expansion (CTE), Z-Axis | ~40 ppm/°C |
| Peel Strength (1 oz copper) | ≥ 4 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Operating Temperature Range | -40°C to +85°C |
Fabrication Guidelines
- Drilling:
- Use standard carbide drill bits for hole preparation. Ensure the holes are clean and free of burrs for effective plating.
- Lamination:
- Apply uniform pressure and temperature during lamination to ensure optimal bonding between layers.
- Plating:
- Use standard copper plating processes for PCB fabrication.
- Routing:
- Precise routing can be done using conventional PCB manufacturing equipment.
Compliance and Certifications
- RoHS Compliant
- REACH Compliant
- UL 94 V-0 Flammability Rating
