Tlam SS HTD Thermally Conductive PCB Substrate
Tlam SS HTD is a thermally conductive printed circuit board (PCB) substrate developed by Laird Technologies. It is engineered to provide superior thermal management in high-temperature and high-voltage applications, such as industrial motor drives and automotive motor controls.
Tlam SS HTD Key Features:
- High Thermal Conductivity: The Tlam SS HTD dielectric has a thermal conductivity of 2.2 W/m-K, facilitating efficient heat dissipation from components.
- High Temperature Rating: Rated for continuous operation at temperatures up to 150°C, making it suitable for high-temperature environments.
- High Voltage Isolation: Capable of withstanding voltages greater than 6000 VDC, ensuring safety and reliability in high-voltage applications.
- RoHS Compliant: Meets environmental standards, being free from hazardous substances.
Applications:
- Automotive: Suitable for low-voltage under-hood and electric vehicle (EV) motor drives.
- Industrial Motor Drives: Applicable in 120-480VAC commercial and industrial motor drives, uninterruptible power supplies (UPS), and welding equipment.
- Power Supplies: Ideal for AC/DC and DC/DC converters in telecommunications and commercial products.
Technical Specifications:
- Dielectric Thickness Options: Available in various thicknesses to balance thermal resistance and voltage isolation requirements.
- Base Plate Materials: Standard constructions include aluminum or copper base plates with thicknesses of 0.040 inches (1 mm) and 0.062 inches (1.6 mm).
- Copper Foil Weight: Standard options are 1 and 2-ounce copper; custom configurations with heavier copper weights are available upon request.
For detailed information, you can refer to the Tlam SS HTD datasheet.