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PCB Material Specification Sheet
laird

Tlam SS HTD Thermally Conductive PCB Substrate

Tlam SS HTD is a thermally conductive printed circuit board (PCB) substrate developed by Laird Technologies. It is engineered to provide superior thermal management in high-temperature and high-voltage applications, such as industrial motor drives and automotive motor controls.

Tlam SS HTD Key Features:

  • High Thermal Conductivity: The Tlam SS HTD dielectric has a thermal conductivity of 2.2 W/m-K, facilitating efficient heat dissipation from components.
  • High Temperature Rating: Rated for continuous operation at temperatures up to 150°C, making it suitable for high-temperature environments.
  • High Voltage Isolation: Capable of withstanding voltages greater than 6000 VDC, ensuring safety and reliability in high-voltage applications.
  • RoHS Compliant: Meets environmental standards, being free from hazardous substances.

Applications:

  • Automotive: Suitable for low-voltage under-hood and electric vehicle (EV) motor drives.
  • Industrial Motor Drives: Applicable in 120-480VAC commercial and industrial motor drives, uninterruptible power supplies (UPS), and welding equipment.
  • Power Supplies: Ideal for AC/DC and DC/DC converters in telecommunications and commercial products.

Technical Specifications:

  • Dielectric Thickness Options: Available in various thicknesses to balance thermal resistance and voltage isolation requirements.
  • Base Plate Materials: Standard constructions include aluminum or copper base plates with thicknesses of 0.040 inches (1 mm) and 0.062 inches (1.6 mm).
  • Copper Foil Weight: Standard options are 1 and 2-ounce copper; custom configurations with heavier copper weights are available upon request.

For detailed information, you can refer to the Tlam SS HTD datasheet.

Author

Eleanor

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