The TC600™ Laminates are a high-performance class of high-frequency laminates used for microwave, RF, and high-speed digital circuit applications. These laminates are designed to provide excellent signal integrity, low loss, and high reliability, making them ideal for telecommunications, satellite communications, aerospace, defense, and other advanced electronic applications.

TC600™ Laminates Data Sheet

Key Features:

1. Material Composition:
   • Base Material: The TC600™ laminates are typically constructed using PTFE (Polytetrafluoroethylene) as the base resin, which is reinforced with woven fiberglass to offer both high mechanical strength and excellent electrical performance at high frequencies.
   • Low Dielectric Loss: The PTFE composition contributes to very low dielectric loss, ensuring minimal signal degradation.
2. Electrical Properties:
   • Dielectric Constant (Dk): Typically 2.55 ± 0.05 at 10 GHz.
   • Dissipation Factor (Df): Typically 0.0012 to 0.002 at 10 GHz.
     • These values ensure low loss and high performance for RF, microwave, and high-speed digital circuit designs.
   • Stable Dielectric Performance: The dielectric constant remains consistent across a broad frequency range, ensuring reliable signal transmission in high-frequency applications.
   • Surface Resistivity: The TC600™ laminate material exhibits excellent surface resistivity, making it suitable for use in high-performance RF circuits where electrical stability and performance are critical.
3. Thermal and Mechanical Properties:
   • Coefficient of Thermal Expansion (CTE): The TC600™ laminate has a low CTE, providing stable performance even in multilayer PCB designs where thermal cycling could otherwise impact the integrity of the circuit.
   • Thermal Stability: These laminates can withstand temperatures up to 300°C in processing environments, making them suitable for high-temperature applications.
   • Glass Transition Temperature (Tg): The TC600™ series features a high Tg, which provides thermal stability and minimizes the risks of delamination or dimensional changes during soldering or operational conditions.
   • Moisture Absorption: The TC600™ laminates are highly resistant to moisture absorption, ensuring stable electrical properties even in humid environments.
4. Fabrication Compatibility:
   • Easy Fabrication: TC600™ laminates can be processed using standard PCB fabrication techniques like laser drilling, etching, and via creation, making them easy to integrate into manufacturing processes.
   • Copper Adhesion: The laminate ensures excellent copper foil adhesion for reliable electrical connections.
   • Surface Finish: TC600™ laminates can be finished with gold, silver, or HASL (Hot Air Solder Leveling), depending on the specific application and circuit requirements.

Applications:

1. High-Frequency Microwave Circuits:
   • Microwave Filters: For use in telecommunications and radar systems.
   • Power Dividers and Couplers: Essential components for power distribution in RF systems.
   • Antennas: Used in phased-array antenna systems and satellite communication applications where signal integrity is crucial.
2. Telecommunications:
   • Used in base stations, signal routing, and waveguides for long-distance communications and signal transmission.
3. Aerospace and Defense:
   • Radar Systems: For applications requiring high-frequency signal transmission and low loss.
   • Satellites: In satellite communication and global positioning systems (GPS).
4. High-Speed Digital Circuits:
   • Used in high-speed digital interconnects and high-performance PCBs where low signal loss and high reliability are necessary.
5. Advanced Networking:
   • Ideal for 5G networking, data centers, and other high-speed communication systems where low-loss interconnects are critical.

Mechanical Properties:

• Thickness: Available in different thickness options, typically ranging from 0.008″ to 0.030″.
• Width and Length: Custom sizes available to meet design requirements.
• Flexural Strength: The TC600™ laminate is engineered to provide high flexural strength, which makes it durable for use in more demanding applications.

Environmental Performance:

• Moisture Resistance: The laminate’s low moisture absorption ensures that it will maintain its electrical properties over time, even in humid or wet environments.
• Environmental Stability: The TC600™ laminates are designed to offer high stability even under varying environmental conditions, such as temperature and humidity fluctuations, ensuring long-term reliability.

The TC600™ Laminates are an ideal solution for high-frequency RF, microwave, and high-speed digital circuits. With their low loss, high thermal stability, and stable dielectric performance, they ensure efficient and reliable signal transmission for demanding applications in telecommunications, aerospace, defense, and networking. These laminates are suitable for both single-layer and multilayer PCBs, offering excellent fabrication compatibility and ensuring signal integrity across a wide frequency range.

For more detailed information and specific technical data, always consult the manufacturer’s product datasheet and application notes for the TC600™ series laminates.