One of the two most common methods of attaching electronic components to PCBs is the through-hole or through-hole process. This technology is older than SMT, and for many years, it was the standard technology for PCB assembly. When surface mount technology became popular in the 1980s, many people thought it would make through-hole PCB assembly obsolete. However, through-hole technology has several advantages that make it still a preferred choice for certain applications.
5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module