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PCB Manufacturing

Innovative printing solutions for front-end RF module packaging

5G communication has the technical characteristics of high frequency, broadband, and high power density, and its demand for RF front-end devices has also increased significantly. At the same time, in order to control the volume of the assembled device, the modularization of the RF front-end is inevitable. The RF front-end module integrates the power amplifier (PA), filter (SAW, TF-SAW BAW, etc.), antenna, switch (Switch) and low noise amplifier (LNA), passive devices, etc. in one module