RT-Duroid® microwave laminates are engineered for high-frequency applications where performance and reliability are critical. During the manufacturing process, mechanical and thermal stresses can be introduced, particularly after etching. Proper stress relief is crucial to maintain dimensional stability, adhesion, and electrical performance. This document outlines the significance of after-etch stress relief and best practices for its implementation.

RT-duroid® microwave laminates are widely used in high-frequency applications due to their excellent electrical and mechanical properties. However, like many PTFE-based materials, RT-duroid laminates can experience stress after the etching process, which may affect the dimensional stability and performance of the final product. Stress relief procedures are essential to mitigate these effects and ensure reliable circuit fabrication.

RT-duroid microwave laminates have demonstrated excellent performance in cryogenic environments, particularly in high-frequency stripline applications. This study, conducted in collaboration with NASA, highlights the reliability, electrical stability, and material resilience of RT-duroid laminates in cryogenic conditions.

RT-duroid microwave laminates are widely used in high-frequency circuits, where precision and reliability are paramount. During the PCB manufacturing process, stress can develop in the copper and substrate due to chemical etching and thermal cycling.