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PCB Material Specification Sheet
ROGERS

Guidelines for Drilling RT-duroid 6002 Bonded Assemblies and Multilayer Boards

RT-duroid® 6002 laminates are widely used in high-frequency and microwave applications due to their excellent electrical and mechanical properties. Drilling is a critical step in fabricating bonded assemblies and multilayer boards with RT-duroid materials. Following the proper guidelines ensures clean vias, prevents delamination, and maintains structural integrity.