The attachment of devices and wirebonding onto RT/duroid® and RO4000® series laminates requires careful consideration to maintain the integrity of high-frequency circuits. These laminates are designed for RF and microwave applications, and proper handling ensures optimal performance and reliability.

High-frequency circuit materials such as RT/duroid® and RO4000® series are widely used in RF and microwave applications. Proper device attachment and wirebonding techniques are crucial for ensuring mechanical stability and electrical performance. Below are detailed guidelines and considerations for these processes.