1. Customer Profile Client: AnonymousIndustry: ADAS (Advanced Driver Assistance Systems), Autonomous VehiclesApplication: 77GHz Long-Range Radar (LRR) for Highway Pilot & Collision Avoidance Customer’s Requirements: Key Challenges: 2. KKPCB’s Radar PCBA Solution (A) Material & Stackup Layer Material Function Key Specs RF Layers Rogers RO3003 Antenna Array & Front-End Dk=3.0, Df=0.0013 @ 77GHz Core Arlon 25FR […]
Client: A leading European audio equipment manufacturer
Industry: High-End Consumer Audio / Professional Sound Systems
Application: Stereo Power Amplifier Modules
Client: Anonymous
Industry: Telecom Infrastructure, 5G Macro/Micro Base Stations
Application: Power Amplifier (PA) Modules + RF Front-End PCBs
High-power base station equipment requiring PCBs are able to handle:
High current (30A+) for PAs
Low-loss RF (3.5GHz-28GHz for 5G)
Thermal stability (85°C ambient, 125°C local hotspots)
Key Challenges Faced:
Delamination risk from mixed thick-copper (6oz) and RF layers.
EMI coupling between power and RF sections.
Thermal warping under high thermal cycling.
Client: Anonymous
Industry: Fiber Optic Test & Measurement, High-Speed Data Transmission
Application: Next-gen 100G/400G+ optical transceivers, OTDR equipment, and 50GHz RF test modules.
FIS designs precision fiber optic tools, requiring ultra-low-loss PCBs to maintain signal integrity at millimeter-wave frequencies (up to 50GHz). Their challenges include:
Insertion loss degrading high-speed signals (>40Gbps).
Impedance mismatches causing reflection noise.
Thermal expansion leading to microvia cracking in compact designs.
The customer is a globally leading manufacturer of communication equipment, specializing in the development and production of large-scale routers, switches, servers, and high-speed networking devices. As modern network communications demand increasingly high signal integrity, reliability, and thermal stability, the customer required an 18-layer PCB with low-loss material (S1000-2M) and advanced immersion gold plating to ensure stable signal transmission and long-term reliability
Basic soldering guide on how to solder electronic components to a printed circuit board (PCB). This is a detailed and complete soldering guide for both automated soldering in mass production and manual soldering in PCB rework and repair.
A Multilayer PCB (Printed Circuit Board) is a type of PCB with more than two conductive layers. Unlike a double-sided PCB, which has two copper layers (top and bottom), a multilayer PCB consists of three or more layers of copper, interconnected by copper-plated vias. The number of layers can range from 3 layers to 40 layers or more, depending on the design requirements
As we step into 2025, the electronics manufacturing industry is poised for transformative changes driven by technological advancements, shifting consumer demands, and global economic factors. At KKPCB, we are committed to staying at the forefront of these developments to deliver cutting-edge solutions to our clients. Here’s an overview of the key trends set to reshape the industry this year.
A multilayer PCB is a printed circuit board that consists of more than two layers, typically at least three or more layers of conductive copper, separated by an insulating material (substrate). These layers are stacked and connected by vias, resulting in a compact and efficient PCB design.
A flexible printed circuit board (FPCB) is a type of PCB that can be bent or twisted to fit into specific spaces or conform to different shapes. Unlike rigid PCBs, FPCBs are made from flexible materials, such as polyimide, and are ideal for use in compact, complex, and high-performance electronic devices.