Surface mount technology is a method of assembling electronic components onto a printed circuit board (PCB). Unlike traditional through-hole technology, where the leads of the component are inserted through holes in the PCB, SMT involves mounting the component directly onto the surface of the PCB. SMT offers advantages such as smaller size, higher manufacturing efficiency, and compatibility with automated assembly processes.
PCB design is a delicate balance of electrical and thermal considerations, with the relationship between current and line width being a cornerstone of reliable circuit functionality. While many empirical formulas, tables, and software tools exist online to guide this aspect of design, this article consolidates the most useful references to assist engineers in optimizing PCB layouts.
PCBs are critical in electronic devices, ensuring electrical connections between components. With increasing circuit density, proper PCB design techniques are essential to ensure reliability and reduce interference.
Train personnel to consistently cut boards following the structural texture direction. If size variation persists, consider alternative substrate materials.
Work with laminate manufacturers to determine proper stress-relief processes before production.
When designing high-speed PCBs, process variations and other factors can significantly impact actual impedance. Automated design tools may not always detect these subtleties, making proactive, defensive design essential. Here’s how to address common challenges in high-speed PCB design.
Electrostatic Discharge (ESD) can damage sensitive components such as MOSFETs, CMOS gates, and PN junctions, leading to issues like gate damage, short circuits, and even melted wiring. This guide offers practical strategies to design PCBs that effectively prevent ESD from harming the circuit.