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Engineering Technology

Issues to Consider in the Production of High-Frequency Microwave Printed Circuit Boards (PCBs)

With the continuous development of high-frequency electronic devices, especially in wireless networks and satellite communications, information products are becoming faster and higher in frequency, and communication products are moving towards large capacity and high-speed wireless transmission for voice, video, and data standardization. As a result, the next generation of products requires high-frequency substrates. The process technology for high-frequency PCB production is continuously improving to meet the diverse needs of users. Based on over ten years of experience in PCB production, this article will detail the key technical aspects and considerations for the production of high-frequency microwave PCBs.

Engineering Technology PCB Assembly PCB Manufacturing
PCB Production Assembly

PCB Prototyping vs. Standard PCB Production Assembly

In the world of PCB manufacturing, two main methods are commonly used: PCB prototyping and standard PCB production. Both methods play critical roles and come with their own characteristics. Reducing the time and costs associated with the development process can significantly increase the success rate of future projects. This article explores the benefits of starting with a prototype PCB for design verification before transitioning to standard PCB production assembly.