There are three main sources of heat in PCB: heat from electronic components; heat from PCB itself; Heat from other parts.
Among the three heat sources, the heating from electronic components is the largest, followed by the heat generated by PCB board, and other heat from the outside based on the overall thermal design of the system.
PCB solder mask is also known as PCB solder resist or PCB solder mask. It is a thin polymer protective layer PCB layer or coating that is applied on the copper traces to avoid initiating corrosion and oxidation processes after the PCB manufacturing process.
As electronic devices become more complex and ubiquitous, the need for reliable and high-performance PCBs continues to grow. PCB testing standards provide a framework for ensuring that these essential components meet industry benchmarks for safety, reliability, and functionality. Manufacturers who adhere to these testing standards are better positioned to deliver high-quality, dependable products, build trust with their customers, and minimize the risk of product failures. Whether through visual inspection, electrical testing, or advanced X-ray analysis, rigorous testing ensures that the PCBs will perform as expected, even in the most challenging environments.
As the largest PCB manufacturer globally, China not only leads in production volume and technology but also continues to innovate. By increasing research and development investment and optimizing production processes, China’s PCB industry has gradually transitioned from low-end manufacturing to high-end production, especially excelling in areas such as high-frequency, high-speed, and high-precision applications. Meanwhile, China’s cost advantages, rich industrial chain resources, and mature supply chain management systems further solidify its dominant position in the global market.
The manufacturing of HDI PCBs began in the late 1980s. With the successive production of PCBs, the first HDI production began in 1984. Since then, designers and manufacturers have been looking for ways to pack more components in a smaller area. HDI boards are designed and manufactured to comply with IPC-2315 and IPC-2226 standards.
The Internet of Things (IoT) is revolutionizing industries worldwide, and its influence on Printed Circuit Board (PCB) design and manufacturing is profound. As IoT devices become more compact, efficient, and interconnected, the demand for innovative PCB designs has surged. This blog delves into how IoT is transforming PCB design and manufacturing, the challenges it poses, and the opportunities it presents.
Incorporating schematic simulation into the PCB design process not only saves valuable time but also increases the accuracy and efficiency of the entire workflow. By automating the process of checking for errors and verifying connections, designers can improve the overall quality of the PCB and minimize the chances of issues in the final design.
Inexperienced PCB designers often overlook critical checks in the later design stages, leading to issues like inadequate line width, misplaced silkscreens, and insufficient spacing near sockets. These errors can cause electrical or manufacturing issues, potentially requiring redesigns and increasing production costs. Below is a comprehensive list of essential PCB design checkpoints to ensure product quality and manufacturability.
Based on recent trends, improving efficiency is a key goal, and the trade-off of using slow switching devices for better EMI is not worth it. Superjunctions can improve efficiency in applications where planar MOSFETs struggle. Superjunction MOSFETs significantly reduce on-resistance and parasitic capacitance compared to traditional planar MOSFET technology. The significant reduction in on-resistance and reduced parasitic capacitance, while helping to improve efficiency, also produces fast switching transitions of voltage (dv/dt) and current (di/dt), forming high-frequency noise and radiated EMI.
When discussing wiring-related technologies, two issues will be discussed: What if management cannot use a double-layer board or a ground plane, but still needs to reduce the noise in the circuit? And how to design the circuit to meet the ground plane requirements? Generally speaking, the solution is to tell management that a ground plane is necessary if reliable circuit performance is to be achieved. The main reason for using a ground plane is that the ground impedance is low and it can reduce EMI to a certain extent. But if cost constraints prevent users from achieving what they need, some suggestions provided in this article, such as star networks and correct current return paths, can also slightly reduce circuit noise.
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