The application of solder paste is one of the most crucial processes in the SMT assembly. This process requires careful attention and a high level of precision. This is because the main goal is to apply solder in the proper location and adequately. Therefore, it is important to carefully coat each pad using the appropriate amount of solder.
Printed Circuit Board (PCB) manufacturing is a complex process that involves multiple steps, one of which is the application of solder paste or other materials onto the board. This is often accomplished through screen printing, a technique that requires a high-quality stencil. The PCB screen printing stencil making process is a crucial part of PCB assembly, as it directly affects the quality and reliability of the final product