PCB layering or stacking is a way of stacking multiple printed circuit boards together while ensuring that there are predefined interconnections between them, allowing multiple printed circuit boards to be installed in the same device. These multi-layer PCBs can multiply the speed and functionality of a device and are composed of at least three conductive layers, with the bottom layer being composited with an insulating board
PCB layering or stacking is a way of stacking multiple printed circuit boards together while ensuring that there are predefined interconnections between them, allowing multiple printed circuit boards to be installed in the same device. These multi-layer PCBs can multiply the speed and functionality of a device and are composed of at least three conductive layers, with the bottom layer being composited with an insulating board.
With HDI boards, you can affix more components on both sides of the bare PCB, allowing you to get more functionality in a smaller space and expand the overall functionality of your device. HDI technology enables you to add functionality while reducing the size and weight of your product.
With the development of electronic information technology, multi-layer PCBs are used in more and more fields. Traditionally, we define PCBs with more than four layers as “multi-layer PCBs” and PCBs with more than ten layers as “high-layer PCBs”. Whether or not a PCB manufacturer can produce high-layer PCBs is an important indicator of its strength. A PCB manufacturer that can produce high-layer PCBs with more than twenty layers is considered to be a PCB company with outstanding technical strength.