In PCB design, effective ESD (Electrostatic Discharge) protection can be achieved through strategic layering, layout, and installation adjustments. ESD protection aims to shield delicate semiconductor chips from static electricity originating from humans, the environment, or even other electronic components, which can damage insulation layers, MOSFET and CMOS gates, PN junctions, and wiring. Here are some recommended techniques to enhance ESD protection in PCB designs.
As electronic products become more advanced, they encounter more sources of electromagnetic interference (EMI) that can disrupt device function and potentially harm health. This guide explores strategies for designing PCB boards with optimized electromagnetic compatibility (EMC), focusing on reducing interference and increasing product resilience.
Electrostatic Discharge (ESD) can damage sensitive components such as MOSFETs, CMOS gates, and PN junctions, leading to issues like gate damage, short circuits, and even melted wiring. This guide offers practical strategies to design PCBs that effectively prevent ESD from harming the circuit.
PCB design translates electrical schematics into a functional product, and its quality directly impacts production efficiency and product reliability. For beginners, mastering PCB layout can be challenging despite familiarity with design software, and common issues often arise. Here, seasoned engineers from KKPCB share their PCB layout insights to help avoid these pitfalls and inspire best practices.
PCB layering or stacking is a way of stacking multiple printed circuit boards together while ensuring that there are predefined interconnections between them, allowing multiple printed circuit boards to be installed in the same device. These multi-layer PCBs can multiply the speed and functionality of a device and are composed of at least three conductive layers, with the bottom layer being composited with an insulating board
PCB layering or stacking is a way of stacking multiple printed circuit boards together while ensuring that there are predefined interconnections between them, allowing multiple printed circuit boards to be installed in the same device. These multi-layer PCBs can multiply the speed and functionality of a device and are composed of at least three conductive layers, with the bottom layer being composited with an insulating board.
With HDI boards, you can affix more components on both sides of the bare PCB, allowing you to get more functionality in a smaller space and expand the overall functionality of your device. HDI technology enables you to add functionality while reducing the size and weight of your product.
With the development of electronic information technology, multi-layer PCBs are used in more and more fields. Traditionally, we define PCBs with more than four layers as “multi-layer PCBs” and PCBs with more than ten layers as “high-layer PCBs”. Whether or not a PCB manufacturer can produce high-layer PCBs is an important indicator of its strength. A PCB manufacturer that can produce high-layer PCBs with more than twenty layers is considered to be a PCB company with outstanding technical strength.