Closely spaced vias are a common design challenge in multi-layer and high-speed PCB boards. Understanding the implications of tight spacing—such as drilling process inefficiencies, reduced solder ring size, and long-term reliability concerns—is essential. By adhering to recommended spacing guidelines, optimizing via placement, and collaborating with manufacturers, designers can enhance production yield, reduce costs, and ensure robust product per
By following these guidelines—such as optimizing trace width, minimizing via use, and ensuring proper documentation for manufacturing—you can significantly improve the performance, reliability, and manufacturability of your PCB designs.
When designing a multi-layer PCB, you need to pay attention to a basic situation, that is, how many wiring layers, ground planes, and power planes are needed to achieve the required functions of the circuit. The establishment of the number of wiring layers, ground planes, and power planes of the multi-layer PCB is related to the basic functions of the circuit, signal integrity, EMI, EMC, manufacturing costs, etc.
High-frequency choke: When wiring the high-frequency circuit board in the high-frequency PCB design, a high-frequency choke device must be connected when the digital ground, analog ground, etc. are connected to the common ground line. Generally, it is a high-frequency ferrite bead with a wire passing through the center hol
According to the rule of thumb, four-layer boards are usually used in high-density and high-frequency situations. Multi-layer PCBs are more than 20DB better than two-layer boards in terms of EMC. Under the condition of a four-layer board, a complete ground plane and a complete power plane can often be used. Under this condition, it is only necessary to connect the ground wires of the circuits divided into several groups to the ground plane, and the working noise is specially handled