The thermal expansion coefficient of these LTCC substrates is adjusted for use as wafer-level packaging substrates. The substrate surface has bumps for electrical connections, and CSP (chip-scale package) can be easily assembled by directly bonding to silicon wafers. Ideal for MEMS and semiconductor ceramic packages with a small number of leads.
Shenzhen KKPCB Technology Co., Ltd. (KKPCB) is a professional PCB and PCBA manufacturer dedicated to providing one-stop electronic manufacturing solutions. Specializing in high-difficulty, small to medium batch PCB and PCBA production, we focus on delivering high-precision, high-reliability products with fast turnaround times to meet customers’ complex design and technical requirements.
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