FR4, often written as FR-4, is a widely recognized and high-performing substrate material used in PCB manufacturing. Its affordability, insulation properties, and structural integrity make it the foundation for most PCB designs. FR4 boards are coated with copper foil using adhesive to create conductive layers, either single or double-sided, depending on the design. This flexibility allows for the development of complex multilayer PCBs, making FR4 the default choice for many applications.
When designing high-speed PCBs, the layer stack-up plays a crucial role in ensuring signal integrity, minimizing crosstalk, and achieving optimal electromagnetic compatibility (EMC). For a standard six-layer board with a thickness of 1.6mm, selecting the right structure can significantly impact performance. Below is an analysis of common six-layer board structures and their suitability for high-speed designs
When designing high-speed PCBs, understanding the core concepts is crucial for ensuring efficiency and functionality. This guide introduces key elements such as layers, vias, pads, and more to help beginners and professionals alike.
When designing high-speed PCBs, process variations and other factors can significantly impact actual impedance. Automated design tools may not always detect these subtleties, making proactive, defensive design essential. Here’s how to address common challenges in high-speed PCB design.