High-frequency PCB is a special circuit board with a higher electromagnetic frequency, which is above 1GHz. The physical properties, precision and technical parameters of high-frequency PCB are very high, and it is often used in radar, military equipment, aerospace and other fields.
This study was conducted to evaluate dimensional movement of Rogers RO4350B
Product through the circuit fabrication process. The study was conducted using Six
Sigma tools and the DMAIC process as a guideline for the evaluation (Define, Measure,
Analyze, Improve, and Control). The Six Sigma project was initiated as a joint exercise between Rogers Corporation and printed circuit board manufacturer Cirtech Inc.
Frequently, designers are concerned about temperature rise of the conductor traces on devices built in microstrip or stripline configurations on RT/duroid® microwave material. The question arises when there are high bias line currents, but the bias line needs to be as narrow as possible to keep its characteristic impedance high. It also is of concern when RF power levels are high.
Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design.
These guidelines were developed to provide fabricators basic information on processing double-sided and multi-layered printed wiring boards (PWB’s) using RO4003C™, RO4350B™ and RO4835™ laminates. Please refer to RO4400™ bondply processing guidelines for additional information on inner-layer preparation and multi-layer bonding.