The interconnection of electrical contacts between components and electromechanical parts in a PCB ensures the system functions as per the circuit schematic. Selecting an appropriate interconnection method depends on the specific application, balancing reliability, processability, and cost. Below are commonly used PCB interconnection methods, along with their advantages, considerations, and application scenarios
This guide delves into the four fundamental characteristics of RF circuits—RF interface, small desired signals, large interference signals, and adjacent channel interference—and highlights essential considerations for PCB design.
Multilayer PCB design follows principles similar to double-layer design, with added structural complexity and a focus on stable signal integrity and efficient routing. With experience in double-layer PCBs, moving to multilayer designs can be manageable.
When designing a multi-layer PCB, you need to pay attention to a basic situation, that is, how many wiring layers, ground planes, and power planes are needed to achieve the required functions of the circuit. The establishment of the number of wiring layers, ground planes, and power planes of the multi-layer PCB is related to the basic functions of the circuit, signal integrity, EMI, EMC, manufacturing costs, etc.
With the development of electronic information technology, multi-layer PCBs are used in more and more fields. Traditionally, we define PCBs with more than four layers as “multi-layer PCBs” and PCBs with more than ten layers as “high-layer PCBs”. Whether or not a PCB manufacturer can produce high-layer PCBs is an important indicator of its strength. A PCB manufacturer that can produce high-layer PCBs with more than twenty layers is considered to be a PCB company with outstanding technical strength.
According to the rule of thumb, four-layer boards are usually used in high-density and high-frequency situations. Multi-layer PCBs are more than 20DB better than two-layer boards in terms of EMC. Under the condition of a four-layer board, a complete ground plane and a complete power plane can often be used. Under this condition, it is only necessary to connect the ground wires of the circuits divided into several groups to the ground plane, and the working noise is specially handled
With the continuous development of science and technology, the functional requirements of electronic devices are also constantly increasing. In order to meet this demand, HDI (High Density Interconnect) circuit boards came into being. HDI circuit boards have attracted much attention for their high density, high performance and high reliability, and have become an important bridge connecting future technologies.
High-frequency circuit boards refer to special circuit boards with higher electromagnetic frequencies, and are one of the most difficult boards
Radio frequency (RF) and microwave (MW) circuits can be found in countless wireless products, from handheld devices used in medical and industrial applications to advanced communications systems used in base stations, radar and global positioning. The success of these high-speed products begins during the product design phase when selecting PCB laminate materials
Frequency range: Generally speaking, high-frequency boards can be defined as PCBs with a frequency above 1GHz. They are mainly used in PCBs in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 mete
- 1
- 2