Client: A leading European audio equipment manufacturer
Industry: High-End Consumer Audio / Professional Sound Systems
Application: Stereo Power Amplifier Modules
Client: Anonymous
Industry: Telecom Infrastructure, 5G Macro/Micro Base Stations
Application: Power Amplifier (PA) Modules + RF Front-End PCBs
High-power base station equipment requiring PCBs are able to handle:
High current (30A+) for PAs
Low-loss RF (3.5GHz-28GHz for 5G)
Thermal stability (85°C ambient, 125°C local hotspots)
Key Challenges Faced:
Delamination risk from mixed thick-copper (6oz) and RF layers.
EMI coupling between power and RF sections.
Thermal warping under high thermal cycling.
Client: Anonymous
Industry: Fiber Optic Test & Measurement, High-Speed Data Transmission
Application: Next-gen 100G/400G+ optical transceivers, OTDR equipment, and 50GHz RF test modules.
FIS designs precision fiber optic tools, requiring ultra-low-loss PCBs to maintain signal integrity at millimeter-wave frequencies (up to 50GHz). Their challenges include:
Insertion loss degrading high-speed signals (>40Gbps).
Impedance mismatches causing reflection noise.
Thermal expansion leading to microvia cracking in compact designs.
hen Rogers high-frequency circuit boards, such as RT-duroid laminates, carry direct current (DC) or radio frequency (RF) current, the temperature rise depends on factors such as conductor resistance, material properties, current flow, and thermal management.
The client specializes in the development and production of a wide range of microwave electronic products. These products are extensively used in satellite communication, television broadcasting, long-range communication, data and image transmission, radar, remote control, remote sensing, electronic reconnaissance, and electronic countermeasures. With deep technical expertise in microwave technology and high-frequency electronic products, the customer serves multiple high-tech industries requiring precise, reliable, and high-frequency transmission solutions.
The Internet of Things (IoT) is revolutionizing industries worldwide, and its influence on Printed Circuit Board (PCB) design and manufacturing is profound. As IoT devices become more compact, efficient, and interconnected, the demand for innovative PCB designs has surged. This blog delves into how IoT is transforming PCB design and manufacturing, the challenges it poses, and the opportunities it presents.
Special processing technologies are non-conventional processes used in the production of printed circuit boards to meet specific needs. These technologies usually involve high-precision, high-complexity processing requirements and are capable of processing circuit boards with special functions or properties, such as high-frequency PCBs, flexible PCBs, and high-density interconnect (HDI) boards.
A motor controller is an electronic or electrical device used to regulate the speed, torque, and position of a motor. It can automatically or manually start, stop, and protect the motor from issues like overloads.
The quality of SMT laser steel mesh depends on factors like manufacturing process, material selection, design precision, and maintenance. By adhering to best practices in cleaning, storage, and handling, you can ensure optimal stencil performance and longevity.
The interconnection of electrical contacts between components and electromechanical parts in a PCB ensures the system functions as per the circuit schematic. Selecting an appropriate interconnection method depends on the specific application, balancing reliability, processability, and cost. Below are commonly used PCB interconnection methods, along with their advantages, considerations, and application scenarios
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