In circuit board manufacturing, various electroplating methods are employed to enhance performance, durability, and contact quality. This article focuses on four specialized electroplating methods commonly used in PCB (printed circuit board) welding processes
With the increase in signal transmission speed and the widespread application of high-frequency circuits, circuit board impedance control has become a key factor in ensuring signal integrity, reducing signal interference, and improving system stability
Copper foils, for the wide range of Rogers’ high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.
Excellent layer stacking is the key to ensure bypass and decoupling of the power bus, minimize transient voltage on the power layer or ground layer, and shield the electromagnetic field of the signal and power supply.
This article starts with the most basic PCB layout and discusses the role and design techniques of PCB layer stacking in controlling EMI radiation