Ceramic substrates play a critical role in modern electronics, offering exceptional thermal performance, mechanical strength, and customization options. Alumina remains the most widely used material due to its affordability and versatility, while aluminum nitride is favored for applications requiring higher thermal conductivity. The choice of manufacturing process—whether HTCC, LTCC, DBC, DPC, or LAM—will depend on the specific needs of the application, including power electronics, electronic packaging, hybrid microelectronics, and multi-chip modules. With their outstanding thermal conductivity, mechanical stability, and electrical insulation properties, ceramic substrates play a pivotal role in developing advanced electronic devices.
Ceramic substrates are typically located within the copper/metal layers of a power module as part of the power electronics circuitry. They function similarly to a PCB, allowing them to optimally perform their intended purpose
Shenzhen KKPCB Technology Co., Ltd. is a company that specializes in the design, manufacture, and assembly of various printed circuit boards (PCBs), including ceramic substrates.