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Standard PCB Technics Capacity

Standard PCB Technics Capacity
Item
Description
DataSheet
Layer
Layer
1-108
Material
Material
SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec
Surface treatment
 
HASL lead-free, Immersion Gold, OSP, Immersion Tin, Immersion Silver, Plating Gold, Plating Tin, ENEPIG
Selectivity surface treatment
 
ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F
Solder mask color
 
Green, Yellow, Black, Matte black, Blue, Red, White, Matte green
Silkscreen color
 
White, Yellow, Black
Max board size with 2L
mm
2000*650mm
Max board size with 4L,6L
mm
570*850mm or 1150*430mm(Exceeding 570mm shall be reviewed)
Max board size with more than 8L
mm
570*670mm or 980*430mm(Exceeding 570mm shall be reviewed)
Min board size
mm
0.5*1.0mm(thickness≤0.5mm), 1.0*2.0mm(thickness≥0.5mm)
Min outline tolerance
mm
±0.05mm(Laser Routing), ±0.1mm(Mechanical Routing)
PCB Board Thickness
mm
0.13-8mm
Double side board thickness
mm
0.13-3.6mm
4 Layers board thickness
mm
0.30-7mm
6 Layers board thickness
mm
0.6-8mm(6L), 0.8-8mm(8L), 1.0-8mm(10L), 1.0-8mm(12L)
The tolerance of board thickness
mm
±0.1mm(thickness≤1.0mm), ±10%mm(thickness>1.0mm)
Min Drilling hole size
mm
0.075-0.1(Laser), 0.15mm(Mechanical)
Single Max Drilling
ww
6.5mm(Drill Bit)
Max Drilling
ww
50mm
Min PTH tolerance
mm
±0.05mm, ±0.075mm
Min NPTH tolerance
mm
±0.05mm(Limitation+0, -0.05mm or +0.05, -0mm)
Min hole tolerance
 
±0.075mm
Max Drilling tolerance
 
±0.1mm
Slot hole
mm
0.5-6mm
Min slot hole length
mm
1.0mm
Slot hole aspect ratio
mm
1:2
Min slot hole tolerance
mm
Slot width, ±0.15mm
Min slot hole tolerance
mm
Slot width directiont 0.10, slot length direction ±0.15
Countersink hole angle &size
 
Big hole 82, 90, 120 degree, dia≤10mm
Countersink hole angle & size
 
PTH&NPTH, Big hole angle 130degree, The dia of the large hole is not greater than 6.3mm
Min pattern width/spacing
mm
0.075/0.075mm
Pattern width tolerance
mm
±20um
Min pad
mm
0.15mm
FR-4 PP
 
106, 1080, 3313, 2116, 7628
Mult press blind buried hole production
 
Press on the same sides 5
Max bore diameter of pad hole plug hole
mm
0.4 Multi press blind & buried hole board
Min thickness of inner
mm
0.05(none blind buried hole), 0.13(blind buried hole)
Min inner
mil
3(18um base copper), 4(35um base copper), ≥3mil
Inner layer treatment
 
Brown Oxygen
Min inner pattern spacing (105um base copper, after compensation)
mil
5
Min inner layer pattern spacing (140um base copper, after compensation)
mil
7
Min inner layer pattern spacing (18um base copper, after compensation)
mil
3
Min inner layer pattern spacing (35um base copper, after compensation)
mil
3.5
Min inner layer pattern spacing (70um base copper, after compensation)
mil
4
Min inner layer pattern width (105um base copper, before compensation)
mil
5
Min inner layer pattern width (140um base copper, before compensation)
mil
7
Min inner layer pattern width(18um base copper, before compensation)
mil
3
Min inner layer pattern width (35um base copper, before compensation)
mil
3
Min inner layer pattern width (70um base copper, before compensation)
mil
4
Min outer layer pattern spacing (105um base copper, after compensation)
mil
6
Min outer layer pattern spacing(12,18um base copper, after compensation)
mil
3.0(18um), 2.5(12um)
Min outer layer pattern spacing(140um base copper, after compensation)
mil
7
Min outer layer pattern spacing(35um base copper, after compensation)
mil
3.5
Min outer layer pattern spacing (70um base copper, after compensation)
mil
5
Min outer layer pattern width (105um base copper, before compensation)
mil
8
Min outer layer pattern width (12, 18um base copper, before compensation)
mil
3.5(18um), 3(12um)
Min outer layer pattern width (140um base copper, before compensation)
mil
9
Min outer layer pattern width (35um base copper, before compensation)
mil
4.5
Min outer layer pattern width (70um base copper, before compensation)
mil
6
Min. spacing from pattern to pad, pad to pad for outer layer(after compensation)
mil
3(12,18um),3.5(35um),5(70um),6(105,140um)
Min. outer pattern and spacing with blind/buried holes plated many times(>=2times)
mil
3.5/3.5 (before compensation)
Min distance from inner layer edge without copper leakage
mil
10
Min inner layer isolation width
mil
8
Min inner layer isolation ring
mil
8(≤6layer), 10(≥8layer)
Min single side width of inner pad(none blind buried hole)
mil
4.5(18, 35um, Can be partial 4), 6(70um), 8(105um)
Min single side width of inner pad (laser hole)
mil
3
Impedance tolerance
%
±5Ω(＜50Ω), ±10%(≥50Ω); ≥50Ω±5%(need to evaluate when it requests)
Min BGA pad diameter
mil
7mil
Min pad diameter
mil
12(0.10mmMechanical or laser drilling)
Min hole copper thinckness (none blind buried hole)
um
average 25, min single point≥20
Min hole copper thinckness (blind buried hole)
um
averager 20, min single point≥18
PP thickness(min)
um
0.075(only H oz base copper)
ENIG: gold thickness
um
0.025-0.10
ENIG: nickle thickness
um
3-5
Immersion silver. silver thickness
um
0.1-0.3
Min HASL LeadFree/pure tin thickness
um
0.4
Gold Finger: gold thickness
um
0.25-1.3(The required value is the thinnest point)
Gold Finger: nickle thickness
um
3-5
Flash Gold: gold thickness
um
0.025-0.10
Golden finger chamfer Angle tolerance
 
±5°
Golden finger chamfering margin tolerance
mil
±5
Min gold finger length
inch
2
Min distance between gold fingers
mil
6
Gold finger next to the TAB does not hurt the min distance
mm
7(Means automatic chamfering)
Long and short gold finger
 
Can be combined with various surface treatments
Surface treatment for long and short gold finger
 
Immersion gold; Flash gold
Immersion tin: Tin thickness
um
0.8-1.5
Electroplate hard gold thick
um
0.15-1.3
Flash Gold: nickle thickness
um
3-5
Max borad thickness of mechanical drilling 0.10mm
mm
0.6
Max borad thickness of mechanical drilling 0.15mm
ww
1.20
Max borad thickness of router bit 0.25mm
mm
5
Bow and twist capability limit
%
0.1(need to evaluate when it requests ≤0.3)
Max Dry film sealing slot
 
5mm*3.0mm;More than one side of sealing hole15mil
Min unilateral width of dry film sealing hole
mil
10
Min S/M bridge width
mil
3(green), 5(other color)(base copper≤10Z)(base coppe2-40Z, All in accordance with the 6mil)
Min unilateralI width of solder mask
mil
2.5(Allow local2mil)
Min solder mask opening (sing side)
mil
2(Flash gold local 1.5, other allow local 1)
Max diameter of ink plug hole(both side)
mm
0.65
Thickness of solder mask ink through hole cover
um
5/8
V-CUT Angle specifications
 
20°, 30°, 45°, 60°
V-CUT(1.0<H≤1.6mm)
mm
0.36(20°), 0.4(30°), 0.5(45°), 0.6(60°)
V-CUT(1.6<H≤2.4mm)
mm
0.42(20°), 0.51(30°), 0.64(45°), 0.8(60°)
V-CUT(2.5≤H≤3.0mm)
mm
0.47(20°), 0.59(30°), 0.77(45°), 0.97(60°)
V-CUT(H≤1.0mm)
mm
0.3(20°), 0.33(30°), 0.37(45°), 0.42(60°)
V-CUT Angle tolerance
mil
±4
V-CUT Angle tolerance
0
±5°
V-CUT Residue thickness
mil
±4
Blue glue white mesh plug hole max diameter
mm
2
Min single side of blue cover pattern or pad
mil
2
Max diameter of blue plastic aluminum plug hole
mm
4.5
Min isolation between blue glue and pad
mil
12
Min single side carbon cap pattern
mil
2
Min isolation between carbon and pad
mil
8
Min isolation between carbon and carbon
mil
12
Min gridding spacing
mil
5(12, 18, 35um), 8(70um)
Min gridding width
mil
5(12, 18, 35um), 10(70um)
Min silk width and height (12, 18um base copper)
 
width 4mil, height:23mil
Min silk width and height(35um base copper)
 
width 5mil, height:30mil
Min silk width and height(70um base copper)
 
width 6mil, height:45mil
Min isolation of silk and pad
mil
6
Min test on resistance
Ω
10
Min distance from test point to edge
mm
0.5
Max test current
mA
200
Max test voltage
V
250
WNH
mil
3.9
Min test pad
mil
3.9
Min etch logo width
mil
8(12,18um),10(35um),12(70um)
Outline tolerance(edge to edge)
mil
±4(Complex outlin and inner grooves with this requirement shall be reviewed)
Min inner angular radius
mm
0.4
Min inner angular radius
mm
±0.10
Special tolerance requirements for board thickness (No interlayer structure
mm
≤2.0±0.1, 2.0-3.0±0.15, ≥3.0±0.2
Max ratio of plate thickness to hole
 
20:1(not inclue≤0.2mm diameter, more than 12:1 shall be reviewed)
Min hole diameter
mm
0.45
Outline method
 
Routing, V-CUT, Stamp-hole
Min router bit diameter of outline
mm
0.6
Min. distance from hole to trace (Not blind/buried holes)
mil
6(≤8layers), 8(≤14layers), 9(≤28layers)
Min. distance from hole to trace (blind/buried holes)
mil
9(Press one time);10(press two times or three times)
Min distance from hole to trace (Laser drill,1 or 2-step)
mil
6
Min single-sided width for via hole pad of outer layer
mil
4(12, 18um)3.5, 4.5(35um), 6(70um), 8(105um), 10(140um)
Min. distance without copper exposure when outline routing
mil
8
Maximum insulation resistance(for test)
MΩ
100
Hole resistance test board thickness limit
mm
0.38-5.0
Hole resistance test aperture limit
mm
min:0.62mm, max0.25mm
ionic soil
ug/cm2
≤1
Copper stripping strength
N/cm
7.8
Resistance weld hardness
H
6
Resistance
 
94V-0
RCC material
um
copper foil:12,resin:65,100um(complete55, 90um)
Thkickness of blue glue
mm
0.5-0.5
Thkickness of blue glue
mm
0.5mm