Standard PCB Technics Capacity

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Standard PCB Technics Capacity
Item	Description	DataSheet
Layer	Layer	1-108
Material	Material	SY, ITEQ, KB, NanYa, Doosan, Isola, TUC, EMC, Ventec
Surface treatment		HASL lead-free,Immersion Gold, OSP, Immersion Tin, Immersion Silver,Plating Gold, Plating Tin, ENEPIG
Selectivity surface treatment		ENIG+OSP, ENIG+G/F, Flash Gold+G/F, Immersion Silver+G/F, Immersion Tin+G/F
Solder mask color		Green, Yellow, Black, Matte black, Blue, Red, White,Matte green
Silkscreen color		White, Yellow, Black
Max board size with 2L	mm	2000*650mm
Max board size with 4L,6L	mm	570850mm or 1150430mm(Exceeding 570mm shall be reviewed)
Max board size with more than 8L	mm	570670mm or 980430mm(Exceeding 570mm shall be reviewed)
Min board size	mm	0.51.0mm(thickness≤0.5mm), 1.02.0mm(thickness≥0.5mm)
Min outline tolerance	mm	±0.05mm(Laser Routing), ±0.1mm(Mechanical Routing)
PCB Board Thickness	mm	0.13-8mm
Double side board thickness	mm	0.13-3.6mm
4 Layers board thickness	mm	0.30-7mm
6 Layers board thickness	mm	0.6-8mm(6L), 0.8-8mm(8L), 1.0-8mm(10L), 1.0-8mm(12L)
The tolerance of board thickness	mm	±0.1mm(thickness≤1.0mm), ±10%mm(thickness>1.0mm)
Min Drilling hole size	mm	0.075-0.1(Laser), 0.15mm(Mechanical)
Single Max Drilling	ww	6.5mm(Drill Bit)
Max Drilling	ww	50mm
Min PTH tolerance	mm	±0.05mm, ±0.075mm
Min NPTH tolerance	mm	±0.05mm(Limitation+0, -0.05mm or +0.05, -0mm)
Min hole tolerance		±0.075mm
Max Drilling tolerance		±0.1mm
Slot hole	mm	0.5-6mm
Min slot hole length	mm	1.0mm
Slot hole aspect ratio	mm	1:2
Min slot hole tolerance	mm	Slot width, ±0.15mm
Min slot hole tolerance	mm	Slot width directiont 0.10, slot length direction ±0.15
Countersink hole angle &size		Big hole 82, 90, 120 degree, dia≤10mm
Countersink hole angle & size		PTH&NPTH, Big hole angle 130degree, The dia of the large hole is not greater than 6.3mm
Min pattern width/spacing	mm	0.075/0.075mm
Pattern width tolerance	mm	±20um
Min pad	mm	0.15mm
FR-4 PP		106, 1080, 3313, 2116, 7628
Mult press blind buried hole production		Press on the same sides 5
Max bore diameter of pad hole plug hole	mm	0.4 Multi press blind & buried hole board
Min thickness of inner	mm	0.05(none blind buried hole), 0.13(blind buried hole)
Min inner	mil	3(18um base copper), 4(35um base copper), ≥3mil
Inner layer treatment		Brown Oxygen
Min inner pattern spacing (105um base copper, after compensation)	mil	5
Min inner layer pattern spacing (140um base copper, after compensation)	mil	7
Min innner layer pattern spacing (18um base copper, after compensation)	mil	3
Min inner layer pattern spacing (35um base copper, after compensation)	mil	3.5
Min inner layer pattern spacing (70um base copper, after compensation)	mil	4
Min inner layer pattern width (105um base copper, before compensation)	mil	5
Min inner layer pattern width (140um base copper, before compensation)	mil	7
Min inner layer pattern width(18um base copper, before compensation)	mil	3
Min inner layer pattern width (35um base copper, before compensation)	mil	3
Min inner layer pattern width (70um base copper, before compensation)	mil	4
Min outer layer pattern spacing (105um base copper, after compensation)	mil	6
Min outer layer pattern spacing(12,18um base copper, after compensation)	mil	3.0(18um), 2.5(12um)
Min outer layer pattern spacing(140um base copper, after compensation)	mil	7
Min outer layer pattern spacing(35um base copper, after compensation)	mil	3.5
Min outer layer pattern spacing (70um base copper, after compensation)	mil	5
Min outer layer pattern width (105um base copper, before compensation)	mil	8
Min outer layer pattern width (12, 18um base copper, before compensation)	mil	3.5(18um), 3(12um)
Min outer layer pattern width (140um base copper, before compensation)	mil	9
Min outer layer pattern width (35um base copper, before compensation)	mil	4.5
Min outer layer pattern width (70um base copper, before compensation)	mil	6
Min.spacing from pattern to pad, pad to pad for outer layer(after compensation)	mil	3(12,18um),3.5(35um),5(70um),6(105,140um)
Min.outer pattern and spacing with blind/buried holes plated many times(>=2times)	mil	3.5/3.5 (before compensation)
Min distance from inner layer edge without copper leakage	mil	10
Min inner layer isolation width	mil	8
Min inner layer isolation ring	mil	8(≤6layer), 10(≥8layer)
Min single side width of inner pad(none blind buried hole)	mil	4.5(18, 35um, Can be partial 4), 6(70um), 8(105um)
Min single side width of inner pad (laser hole)	mil	3
Impedance tolerance	%	±5Ω(＜50Ω), ±10%(≥50Ω); ≥50Ω±5%(need to evaluate when it requests)
Min BGA pad diameter	mil	7mil
Min pad diameter	mil	12(0.10mmMechanical or laser drilling)
Min hole copper thinckness (none blind buried hole)	um	average 25, min single point≥20
Min hole copper thinckness (blind buried hole)	um	averager 20, min single point≥18
PP thickness(min)	um	0.075(only H oz base copper)
ENIG: gold thickness	um	0.025-0.10
ENIG: nickle thickness	um	3-5
Immersion silver.silver thickness	um	0.1-0.3
Min HASL LeadFree/pure tin thickness	um	0.4
Gold Finger:gold thickness	um	0.25-1.3(The required value is the thinnest point)
Gold Finger:nickle thickness	um	3-5
Flash Gold:gold thickness	um	0.025-0.10
Golden finger chamfer Angle tolerance		±5°
Golden finger chamfering margin tolerance	mil	±5
Min gold finger length	inch	2
Min distance between gold fingers	mil	6
Gold finger next to the TAB does not hurt the min distance	mm	7(Means automatic chamfering)
Long and short gold finger		Can be combined with various surface treatments
Surface treatment for long and short gold finger		lmmersion gold;Flash gold
Immersion tin:Tin thickness	um	0.8-1.5
Electroplate hard gold thick	um	0.15-1.3
Flash Gold: nickle thickness	um	3-5
Max borad thickness of mechanical drilling 0.10mm	mm	0.6
Max borad thickness of mechanical drilling 0.15mm	ww	1.20
Max borad thickness of router bit 0.25mm	mm	5
Bow and twist capability limit	%	0.1(need to evaluate when it requests ≤0.3)
Max Dry film sealing slot		5mm*3.0mm;More than one side of sealing hole15mil
Min unilateral width of dry film sealing hole	mil	10
Min S/M bridge width	mil	3(green), 5(other color)(base copper≤10Z)(base coppe2-40Z, All in accordance with the 6mil)
Min unilateralI width of solder mask	mil	2.5(Allow local2mil)
Min solder mask opening (sing side)	mil	2(Flash gold local 1.5, other allow local 1)
Max diameter of ink plug hole(both side)	mm	0.65
Thickness of solder mask ink through hole cover	um	5/8
V-CUT Angle specifications		20°, 30°, 45°, 60°
V-CUT(1.0<H≤1.6mm)	mm	0.36(20°), 0.4(30°), 0.5(45°), 0.6(60°)
V-CUT(1.6<H≤2.4mm)	mm	0.42(20°), 0.51(30°), 0.64(45°), 0.8(60°)
V-CUT(2.5≤H≤3.0mm)	mm	0.47(20°), 0.59(30°), 0.77(45°), 0.97(60°)
V-CUT(H≤1.0mm)	mm	0.3(20°), 0.33(30°), 0.37(45°), 0.42(60°)
V-CUT Angle tolerance	mil	±4
V-CUT Angle tolerance	0	±5°
V-CUT Residue thickness	mil	±4
Blue glue white mesh plug hole max diameter	mm	2
Min single side of blue cover pattern or pad	mil	2
Max diameter of blue plastic aluminum plug hole	mm	4.5
Min isolation between blue glue and pad	mil	12
Min single side carbon cap pattern	mil	2
Min isolation between carbon and pad	mil	8
Min isolation between carbon and carbon	mil	12
Min gridding spacing	mil	5(12, 18, 35um), 8(70um)
Min gridding width	mil	5(12, 18, 35um), 10(70um)
Min silk width and height (12, 18um base copper)		width 4mil, height:23mil
Min silk width and height(35um base copper)		width 5mil, height:30mil
Min silk width and height(70um base copper)		width 6mil, height:45mil
Min isolation of silk and pad	mil	6
Min test on resistance	Ω	10
Min distance from test point to edge	mm	0.5
Max test current	mA	200
Max test voltage	V	250
WNH	mil	3.9
Min test pad	mil	3.9
Min etch logo width	mil	8(12,18um),10(35um),12(70um)
Outline tolerance(edge to edge)	mil	±4(Complex outlin and inner grooves with this requirement shall be reviewed)
Min inner angular radius	mm	0.4
Min inner angular radius	mm	±0.10
Special tolerance requirements for board thickness (No interlayer structure	mm	≤2.0±0.1, 2.0-3.0±0.15, ≥3.0±0.2
Max ratio of plate thickness to hole		20:1(not inclue≤0.2mm diameter, more than 12:1 shall be reviewed)
Min hole diameter	mm	0.45
Outline method		Routing,V-CUT,Stamp-hole
Min router bit diameter of outline	mm	0.6
Min. distance from hole to trace (Not blind/buried holes)	mil	6(≤8layers), 8(≤14layers), 9(≤28layers)
Min.distance from hole to trace (blind/buried holes)	mil	9(Press one time);10(press two times or three times)
Min distance from hole to trace (Laser drill,1 or 2-step)	mil	6
Min single-sided width for via hole pad of outer layer	mil	4(12, 18um)3.5, 4.5(35um), 6(70um), 8(105um), 10(140um)
Min.distance without copper exposure when outline routing	mil	8
Maximum insulation resistance(for test)	MΩ	100
Hole resistance test board thickness limit	mm	0.38-5.0
Hole resistance test aperture limit	mm	min:0.62mm, max0.25mm
ionic soil	ug/cm2	≤1
Copper stripping strength	N/cm	7.8
Resistance weld hardness	H	6
Resistance		94V-0
RCC material	um	copper foil:12,resin:65,100um(complete55, 90um)
Thkickness of blue glue	mm	0.5-0.5
Thkickness of blue glue	mm	0.5mm

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