Seeed+KB6160+FR4+Laminates+Datasheet
KB6160+FR4 is a hybrid laminate combining the high-performance properties of KB6160 material with standard FR4 epoxy-based laminates. This unique combination offers excellent signal integrity for high-frequency applications while maintaining cost-effectiveness and versatility. It is suitable for multilayer PCB designs requiring a balance between performance and affordability.
Key Features
- Enhanced High-Frequency Performance
- KB6160 layer provides low dielectric loss and stable electrical properties at high frequencies.
- Cost Efficiency
- Integration with FR4 reduces costs compared to using high-frequency materials exclusively.
- Thermal and Mechanical Stability
- Withstands thermal cycling and mechanical stress, ensuring reliability in demanding applications.
- Multilayer Compatibility
- Ideal for hybrid PCBs combining high-speed and standard signal layers.
Technical Specifications
KB6160 Properties
| Property | Value |
|---|---|
| Dielectric Constant (Dk) | ~3.6 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.004 (10 GHz) |
| Thermal Conductivity | ~0.5 W/m·K |
| Peel Strength (1 oz Copper) | ≥ 9 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Moisture Absorption | < 0.05% |
FR4 Properties
| Property | Value |
|---|---|
| Dielectric Constant (Dk) | ~4.5 (1 MHz) |
| Dissipation Factor (Df) | ≤ 0.02 |
| Thermal Conductivity | ~0.3 W/m·K |
| Peel Strength (1 oz Copper) | ≥ 8 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Moisture Absorption | ≤ 0.10% |
Applications
- Telecommunications: Base stations, antennas, and RF components.
- Aerospace and Defense: Radar and communication systems.
- Automotive Electronics: Advanced driver-assistance systems (ADAS).
- Consumer Electronics: High-speed digital and RF circuits.
Processing Guidelines
Storage and Handling
- Store materials in a clean, dry environment at 20–25°C with low humidity.
- Handle with gloves to avoid contamination.
Drilling
- Use carbide or diamond-coated drill bits for KB6160 layers.
- Standard FR4 drilling parameters apply to FR4 sections.
Lamination
- Optimize lamination cycles for hybrid stack-ups, ensuring proper resin flow.
- Pre-bake both KB6160 and FR4 components to remove residual moisture.
Etching and Plating
- KB6160 layers support standard copper etching and plating processes.
- FR4 layers can be processed with traditional methods.
Assembly
- Suitable for lead-free and leaded soldering techniques.
- Ensure proper thermal profiling to accommodate both materials.
Advantages of KB6160+FR4 Hybrid Designs
- Design Flexibility
- Tailors high-performance layers for critical signal paths while maintaining affordability.
- Reliable Performance
- Maintains signal integrity and mechanical durability under thermal cycling.
- Cost-Effective Multilayer Construction
- Reduces costs without sacrificing performance in mixed-signal designs.
KB6160+FR4 hybrid laminates deliver a practical solution for complex PCB designs requiring high-frequency performance and cost control. For detailed processing parameters, consult the manufacturer’s datasheet or technical support team.
