Over 10 years we help companies reach their financial and branding goals. Engitech is a values-driven technology agency dedicated.

Gallery

Contacts

411 University St, Seattle, USA

engitech@oceanthemes.net

+1 -800-456-478-23

PCB Material Specification Sheet
KB

Seeed+KB6160+FR4+Laminates+Datasheet

KB6160 is a conventional FR-4 laminate produced by Kingboard Laminates Holdings Ltd., widely used in the fabrication of printed circuit boards (PCBs) due to its reliable performance and compliance with industry standards.

KB6160Key Features:

  • UVB and AOI Compatibility: Designed to be compatible with ultraviolet blocking (UVB) and automatic optical inspection (AOI) processes, enhancing productivity and accuracy in PCB manufacturing.
  • Excellent Heat Resistance and Mechanical Properties: Exhibits robust thermal stability and mechanical strength, making it suitable for various electronic applications.
  • Compliance with IPC-4101B Specifications: Meets the standards set by IPC-4101B, ensuring quality and reliability in PCB applications.

Typical Applications:

  • Consumer Electronics: Utilized in devices such as smartphones, tablets, and other portable electronics.
  • Communication Equipment: Applied in routers, switches, and other networking hardware.
  • Industrial Equipment: Suitable for automation systems, control panels, and instrumentation.

Technical Specifications:

  • Glass Transition Temperature (Tg): Approximately 135°C, indicating the temperature at which the material transitions from a hard, glassy state to a soft, rubbery state.
  • Thermal Stress: Withstands thermal stress for ≥180 seconds at 288°C (unetched), demonstrating its resilience under high-temperature conditions.
  • Peel Strength (1 oz Copper): Exhibits a peel strength of ≥1.05 N/mm after floating at 288°C for 10 seconds, indicating strong adhesion between the copper foil and laminate.
  • Flammability Rating: Rated UL94 V-0, signifying that the material stops burning within 10 seconds on a vertical specimen; it does not drip flaming particles.
  • Dielectric Constant (Dk): Approximately 4.5 at 1 MHz, affecting the signal transmission speed within the PCB.
  • Dissipation Factor (Df): Approximately 0.017 at 1 MHz, representing the energy loss within the material.

For detailed information, you can refer to the KB-6160 datasheet.

Author

Eleanor

Leave a comment

Your email address will not be published. Required fields are marked *