RT-duroid® laminatesare high-performance PTFE-based composite materials manufactured by Rogers Corporation. These laminates are primarily used in RF, microwave, and high-frequency applications due to their exceptional dielectric properties, thermal stability, and chemical resistance.
1. Composition of RT-duroid Composites
Base Material:
Polytetrafluoroethylene (PTFE): Provides a low-loss, stable dielectric medium with excellent high-frequency performance.
Reinforcements:
Glass Microfibers: Enhance mechanical stability and reduce dimensional changes.
Ceramic Fillers (in some variants): Improve thermal conductivity and reduce dielectric constant variation.
Copper Cladding:
Available in different thicknesses and types (e.g., rolled or electrodeposited copper) to meet specific circuit requirements.
2. Key Properties of PTFE-Based RT-duroid Laminates
Property
Performance
Dielectric Constant (ϵr\epsilon_rϵr)
Low and stable (e.g., 2.20 for RT-duroid 5880).
Loss Tangent (tanδ\tan \deltatanδ)
Very low (e.g., 0.0009 for RT-duroid 5880 at 10 GHz).
Use sharp carbide or diamond-coated tools to avoid fraying the PTFE matrix.
Etching:
PTFE’s inert surface requires special preparation (e.g., sodium etching) for metallization.
Lamination:
Follow controlled pressure and temperature cycles to avoid warping or delamination.
Thermal Expansion Management:
Use compatible materials to prevent stress during thermal cycling.
7. Comparison with Standard Materials (e.g., FR-4)
Property
RT-duroid
FR-4
Dielectric Constant
Low (e.g., 2.2 – 2.33)
Higher (e.g., 4.2 – 4.7)
Loss Tangent
Very low (e.g., 0.0009)
Higher (e.g., 0.02)
Thermal Stability
Excellent
Moderate
Cost
Higher
Lower
RT-duroid PTFE-based laminates are engineered for precision and reliability in demanding RF and microwave applications. Their unique combination of electrical, mechanical, and thermal properties makes them a superior choice for cutting-edge technologies in aerospace, telecommunications, and beyond