RT-Duroid® 6006 and 6010LM laminates are high-performance microwave materials designed for applications requiring a high dielectric constant (Dk) and low loss. They are ceramic-filled polytetrafluoroethylene (PTFE) composites, known for their excellent electrical properties, mechanical stability, and thermal performance.

1. Key Properties

Property	RT-Duroid 6006	RT-Duroid 6010LM
Dielectric Constant (Dk)	6.15 ± 0.15 @ 10 GHz	10.2 ± 0.25 @ 10 GHz
Dissipation Factor (Df)	0.0027 @ 10 GHz	0.0023 @ 10 GHz
Thermal Coefficient of Dk	-387 ppm/°C	-425 ppm/°C
Thermal Conductivity	0.78 W/m·K	0.66 W/m·K
Volume Resistivity	1.5 × 10¹⁰ MΩ·cm	1.2 × 10¹⁰ MΩ·cm
Moisture Absorption	<0.1%	<0.1%
Operating Temperature Range	-55°C to +200°C	-55°C to +200°C
Density	2.75 g/cm³	3.1 g/cm³

2. Features

• High Dielectric Constant (Dk):
  • Supports miniaturization of circuits and components.
• Low Dissipation Factor (Df):
  • Ensures low signal loss and excellent performance at high frequencies.
• Thermal Stability:
  • Consistent electrical performance across a wide temperature range.
• Mechanical Robustness:
  • Suitable for both single-layer and multilayer constructions.
• Low Moisture Absorption:
  • Reliable in high-humidity environments.
• Environmentally Resistant:
  • Ideal for aerospace, defense, and high-reliability applications.

3. Applications

• Microwave Antennas:
  • High-performance, compact designs for communications and radar systems.
• Power Amplifiers:
  • Enhanced stability for RF and microwave power devices.
• Filters and Resonators:
  • Precision-tuned for narrowband and high-Q circuits.
• Phased Array Radar Systems:
  • Minimal phase shift and stable impedance for accurate beamforming.
• Multilayer PCBs:
  • Used in advanced designs requiring controlled impedance and high reliability.

4. Processing Guidelines

Drilling

• Use carbide or diamond-coated drills to minimize burrs.
• Coolant or vacuum systems are recommended to prevent debris buildup.

Etching

• Compatible with standard etching processes.
• Uniform etchant application ensures precise pattern formation.

Lamination

• Use low-flow bondply materials for multilayer boards.
• Maintain even pressure and temperature during lamination to prevent warping.

Plating

• Suitable for conventional plating processes.
• Surface preparation methods such as plasma or chemical etching improve adhesion.

5. Available Configurations

Thickness Options

• Available from 0.010” (0.25 mm) to 0.125” (3.18 mm).

Copper Cladding

• Standard cladding includes 1 oz/ft² (35 µm) and 2 oz/ft² (70 µm) copper.
• Heavier copper cladding available for high-current applications.

6. Typical Performance Characteristics

Electrical Stability

• Minimal Dk variation with temperature ensures consistent signal propagation.

Thermal Performance

• High thermal conductivity aids in heat dissipation, enhancing reliability.

Environmental Resilience

• Low moisture absorption and chemical resistance make it suitable for harsh environments.

7. Safety and Handling

• Ventilation:
  • Use proper exhaust systems when machining to avoid inhalation of PTFE particulates.
• Personal Protective Equipment (PPE):
  • Gloves, goggles, and masks are recommended during processing.
• Disposal:
  • Dispose of scrap material according to local environmental regulations.

RT-Duroid® 6006 and 6010LM laminates offer industry-leading performance for high-frequency and microwave applications. Their excellent electrical, thermal, and mechanical properties make them an ideal choice for demanding environments such as aerospace, defense, and telecommunications.