RT-duroid® 6002 laminates are high-frequency circuit materials designed for superior electrical and mechanical performance. These laminates are reinforced with ceramic fillers, providing excellent dimensional stability and low dielectric loss, making them ideal for microwave, RF, and high-speed digital applications.

Key Features

1. Low Dielectric Constant (DkD_kDk​):
   • Dk=2.94D_k = 2.94Dk​=2.94 (±0.04), stable across a wide frequency range.
2. Low Loss Tangent (tan⁡δ\tan\deltatanδ):
   • Typical value: 0.00120.00120.0012 at 10 GHz, ensuring minimal signal attenuation.
3. Thermal Stability:
   • Exceptional dimensional stability under thermal cycling and low Z-axis expansion.
4. Moisture Resistance:
   • Low water absorption (<0.1%), ensuring stable electrical properties in humid conditions.
5. Processability:
   • Compatible with standard PCB fabrication techniques, including drilling, etching, and plating.

Applications

• Aerospace and satellite communication systems
• High-frequency antennas and phased arrays
• Microwave components: filters, couplers, and power dividers
• High-speed digital and RF circuit boards

Technical Specifications

Property	Typical Value
Dielectric Constant (DkD_kDk​)	2.94 (±0.04) at 10 GHz
Loss Tangent (tan⁡δ\tan\deltatanδ)	0.0012 at 10 GHz
Thermal Conductivity	0.43 W/m·K
Coefficient of Thermal Expansion	17 ppm/°C (Z-axis)
Water Absorption	<0.1%
Volume Resistivity	109 Ω⋅cm10^{9} \, \Omega \cdot \text{cm}109Ω⋅cm
Surface Resistivity	108 Ω10^{8} \, \Omega108Ω
Flammability Rating	UL 94 V-0

Mechanical Properties

Property	Value
Tensile Strength	5,000 psi
Flexural Strength	12,000 psi
Young’s Modulus	400,000 psi
Density	2.1 g/cm³

Available Thicknesses and Copper Cladding

1. Standard Thicknesses:
   • 0.010” (10 mils), 0.020” (20 mils), 0.030” (30 mils), 0.060” (60 mils)
2. Copper Cladding Options:
   • Electro-deposited copper (ED)
   • Reverse-treated copper (RT)
   • Rolled annealed copper (RA)

Processing Guidelines

1. Drilling:
   • Use carbide or diamond-coated drill bits.
   • Employ high-speed spindles and air blast cooling to prevent PTFE smearing.
2. Etching:
   • Standard copper etchants are compatible; ensure precise control for intricate designs.
3. Lamination:
   • Surface preparation with plasma or sodium etching enhances adhesion.
4. Plating:
   • Recommended to use plasma treatment before electroless plating.

Environmental Performance

• Moisture Resistance:
  • Ensures electrical stability in high-humidity conditions.
• Temperature Tolerance:
  • Suitable for applications operating between −40°C-40°C−40°C and +125°C+125°C+125°C.

Certifications and Compliance

• RoHS and REACH compliant
• Meets NASA low outgassing requirements for space applications
• UL 94 V-0 flammability rating