RT-duroid 5870 Laminates
RT-duroid 5870 laminates are high-performance microwave and radio frequency (RF) circuit materials manufactured by Rogers Corporation. These laminates are widely used in high-frequency applications due to their low dielectric constant, low loss tangent, and excellent stability under various environmental conditions.
1. Key Features of RT-duroid 5870
- Low Dielectric Constant (ϵr=2.33\epsilon_r = 2.33ϵr=2.33):
- Minimizes signal delay and ensures efficient propagation of electromagnetic waves.
- Suitable for high-speed digital and RF circuits.
- Low Loss Tangent (tanδ\tan \deltatanδ):
- Typically 0.0012 at 10 GHz, ensuring minimal signal loss.
- Ideal for applications requiring low insertion loss.
- PTFE-based Composition:
- The laminate is reinforced with glass microfibers, providing mechanical stability while maintaining the desirable electrical properties of PTFE.
- Low Moisture Absorption:
- Moisture absorption is typically less than 0.02%, making it suitable for humid environments.
- Ensures consistent performance in varying environmental conditions.
- Temperature Stability:
- Can operate over a wide temperature range, typically from -200°C to +200°C.
- Exhibits minimal thermal expansion, reducing stress on solder joints and other components.
- Chemical Resistance:
- Resistant to most chemicals, making it durable in harsh environments.
2. Applications of RT-duroid 5870
- High-Frequency Circuits:
- Antennas, amplifiers, and filters for RF and microwave communication systems.
- Aerospace and Defense:
- Radar systems, satellite communication devices, and avionics.
- Space Applications:
- Low outgassing properties make it ideal for use in vacuum and space environments.
- Automotive Radar Systems:
- Used in advanced driver-assistance systems (ADAS) and vehicle-to-everything (V2X) communication.
- Medical Devices:
- High-frequency imaging systems and sensors.
3. Typical Properties of RT-duroid 5870
Property | Value | Notes |
---|---|---|
Dielectric Constant (ϵr\epsilon_rϵr) | 2.33 | ± 0.02 tolerance. |
Loss Tangent (tanδ\tan \deltatanδ) | 0.0012 @ 10 GHz | Ensures low signal loss. |
Moisture Absorption (%) | < 0.02 | High reliability in humid environments. |
Thermal Conductivity (W/m·K) | 0.2 | Adequate heat dissipation for RF devices. |
Operating Temperature (°C) | -200 to +200 | Wide temperature range for various uses. |
Peel Strength (N/mm) | 0.7 | Good adhesion of copper cladding. |
Density (g/cm³) | ~2.1 | Lightweight material. |
4. Fabrication Considerations
- Drilling and Machining:
- Use carbide or diamond-coated tools to prevent fraying of the PTFE/glass microfiber composite.
- Etching and Metallization:
- Chemical treatments may be required to enhance copper adhesion due to PTFE’s inert surface.
- Lamination:
- Handle with care to avoid contamination and maintain consistent dielectric properties.
- Thermal Expansion Management:
- While RT-duroid 5870 has low CTE\text{CTE}CTE, ensure compatible materials are used to prevent stress during thermal cycling.
5. Comparison with RT-duroid 5880
Feature | RT-duroid 5870 | RT-duroid 5880 |
---|---|---|
Dielectric Constant (ϵr\epsilon_rϵr) | 2.33 | 2.20 |
Loss Tangent (tanδ\tan \deltatanδ) | 0.0012 | 0.0009 |
Reinforcement Material | Glass microfiber | Glass microfiber |
Cost | Moderate | Slightly higher |
Primary Application | Broad RF and microwave use | Ultra-low loss RF systems |
6. Advantages
- High signal integrity for RF and microwave applications.
- Stable performance under extreme environmental conditions.
- Reliable for both commercial and aerospace applications.
7. Disadvantages
- Higher cost compared to standard FR-4 materials.
- PTFE-based laminates require specialized handling and fabrication techniques.