RO4500 Series Cost Performance Antenna Grade Laminates
The RO4500™ series antenna-grade laminates are designed to provide a cost-effective solution for high-frequency applications. These laminates offer exceptional electrical performance, high thermal reliability, and ease of processing, making them ideal for a wide range of antenna and wireless communication systems.
Key Features
- Stable Dielectric Properties:
- Uniform dielectric constant (Dk) across a wide frequency range.
- Low dissipation factor (Df) for minimal signal loss.
- Thermal Reliability:
- High thermal conductivity for improved heat management.
- Excellent dimensional stability, reducing design complexity.
- Cost Efficiency:
- Optimized for price-sensitive applications without compromising performance.
- Ease of Processing:
- Compatible with FR-4 manufacturing processes.
- Supports lead-free soldering and other advanced assembly techniques.
Material Properties
| Property | RO4533™ | RO4535™ |
|---|---|---|
| Dielectric Constant (Dk) | 3.3 ± 0.05 | 3.5 ± 0.05 |
| Dissipation Factor (Df) | 0.0021 @ 10 GHz | 0.0027 @ 10 GHz |
| Thermal Conductivity | 0.5 W/m·K | 0.5 W/m·K |
| Moisture Absorption | <0.1% | <0.1% |
| Thermal Decomposition (Td) | 390°C | 390°C |
| Glass Transition Temperature (Tg) | >280°C | >280°C |
| Peel Strength | ≥7 lb/in | ≥7 lb/in |
Applications
- Patch antennas for GPS and communication systems
- Automotive radar and telematics
- Base station antennas
- Internet of Things (IoT) devices
- High-frequency microwave circuits
Processing Guidelines
1. Drilling
- Use carbide drill bits for precise hole formation.
- Maintain a spindle speed of 150,000–200,000 RPM with a feed rate of 2–3 mil/rev.
2. Etching
- Standard copper etching processes are compatible.
- Ensure accurate control for consistent line widths and spacing.
3. Lamination
- Compatible with standard FR-4 processes.
- Laminate using temperatures of 425–450°F (220–230°C) under a pressure of 200–400 psi.
4. Solder Mask and Finishes
- Apply solder masks compatible with high-frequency laminates.
- Suitable finishes include ENIG, immersion silver, or tin, and OSP.
Performance Highlights
- Low Loss:
- Provides minimal signal degradation, crucial for antenna efficiency and range.
- Thermal Management:
- High thermal conductivity supports high-power designs and ensures system reliability.
- Environmental Stability:
- Low moisture absorption ensures consistent performance in humid environments.
Benefits
- Cost Savings: Ideal for large-scale, price-sensitive antenna applications.
- Design Flexibility: Stable dielectric properties simplify impedance matching and design iterations.
- Durability: Enhanced thermal and mechanical properties ensure long-lasting performance.
Available Configurations
- Thickness Options: Available in multiple thicknesses to suit application-specific requirements.
- Copper Cladding: Offered with various copper thicknesses, including rolled and electrolytic copper.
RO4500™ series laminates are engineered for high-frequency antenna applications, balancing cost and performance effectively. Their ease of processing, coupled with superior electrical and thermal properties, make them a preferred choice for RF and microwave designers.
