RO4400 Series Bondply Data Sheet – RO4450F and RO4460G2 Bondply
The RO4400® series bondply materials are designed for use in multilayer high-frequency circuit constructions. These bondplys provide excellent dielectric performance, low loss, and high thermal reliability. RO4450F™ and RO4460G2™ are compatible with Rogers RO4000® laminates, ensuring a seamless integration for complex RF and microwave applications.
Key Properties
| Property | RO4450F™ | RO4460G2™ |
|---|---|---|
| Dielectric Constant (Dk) | 3.52 ± 0.05 | 6.15 ± 0.15 |
| Dissipation Factor (Df) | 0.004 @ 10 GHz | 0.0038 @ 10 GHz |
| Thermal Conductivity | 0.50 W/m·K | 0.80 W/m·K |
| Peel Strength | ≥7 lb/in | ≥7 lb/in |
| Moisture Absorption | <0.1% | <0.1% |
| Thermal Decomposition (Td) | 390°C | 390°C |
| Glass Transition (Tg) | >280°C | >280°C |
Applications
- Multilayer RF/Microwave circuits
- Automotive radar systems
- High-performance wireless infrastructure
- Aerospace and defense systems
Fabrication Guidelines
Lamination
- Press Parameters:
- Pressure: 200–400 psi
- Temperature: 425–450°F (220–230°C)
- Time: Maintain peak temperature for at least 60 minutes.
- Preparation:
- Ensure clean, dry surfaces before lamination.
- Use release films to prevent adhesion to press plates.
Drilling and Hole Preparation
- Use carbide drill bits optimized for ceramic-filled materials.
- Perform plasma or chemical cleaning to ensure hole cleanliness.
Etching and Plating
- Compatible with standard PCB etching and plating processes.
- Protect bondply layers during chemical treatments.
Performance Highlights
1. Low Loss
- Both RO4450F and RO4460G2 bondplys exhibit minimal dielectric loss, ensuring consistent performance at high frequencies.
2. High Thermal Stability
- Superior thermal conductivity and high Tg make these bondplys ideal for high-power and temperature-sensitive applications.
3. Moisture Resistance
- Low moisture absorption enhances reliability in humid or high-moisture environments.
Storage and Handling
- Store materials in a cool, dry environment.
- Avoid prolonged exposure to high humidity or direct sunlight.
- Use within the manufacturer’s recommended shelf life.
Available Configurations
- Thickness Options: Multiple thicknesses available for both RO4450F™ and RO4460G2™ to accommodate design needs.
- Panel Sizes: Standard and custom panel sizes.
RO4450F™ and RO4460G2™ bondply materials deliver excellent performance for multilayer high-frequency applications. Their compatibility with Rogers laminates ensures high reliability and design flexibility for complex RF and microwave circuits.
