RO4360G2 High Frequency Laminates Data Sheet
Rogers RO4360G2™ laminates are engineered for RF and microwave applications that demand a high dielectric constant (Dk) and robust mechanical performance. These laminates provide enhanced circuit density, lower signal loss, and improved thermal conductivity, making them ideal for advanced designs in telecommunications, aerospace, and automotive radar systems.
Key Features and Benefits
| Feature | Description |
|---|---|
| Dielectric Constant (Dk) | 6.15 ± 0.15 (z-axis, 10 GHz) |
| Low Loss | Dissipation factor (Df) of 0.0038 at 10 GHz ensures minimal signal loss. |
| Thermal Conductivity | High thermal conductivity of 0.8 W/m·K supports heat dissipation in high-power applications. |
| FR-4 Compatibility | Compatible with standard FR-4 processing, simplifying manufacturing and reducing costs. |
| Mechanical Stability | Excellent dimensional stability ensures precision in multilayer and complex circuit designs. |
| Lead-Free Soldering | Designed to withstand lead-free soldering processes with no significant degradation. |
Material Properties
| Property | Typical Value | Test Method |
|---|---|---|
| Dielectric Constant (Dk) | 6.15 ± 0.15 | IPC-TM-650 2.5.5.5 @ 10 GHz |
| Dissipation Factor (Df) | 0.0038 @ 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Conductivity | 0.8 W/m·K | ASTM E1952 |
| Coefficient of Thermal Expansion (CTE): z-axis | 50 ppm/°C below Tg | IPC-TM-650 2.4.41 |
| Glass Transition Temperature (Tg) | >280°C | TMA |
| Peel Strength | 1.0 N/mm | IPC-TM-650 2.4.8 |
| Moisture Absorption | <0.1% | IPC-TM-650 2.6.2.1 |
Applications
- Telecommunications
- Base stations, amplifiers, and filters for 5G networks.
- Automotive
- Advanced driver-assistance systems (ADAS) and radar sensors.
- Aerospace and Defense
- Low-loss RF circuits and high-power microwave designs.
- Power Amplifiers
- High-density circuits with improved thermal management.
Processing Guidelines
- Drilling and Hole Preparation:
- Use optimized drill bits for high-frequency laminates to minimize delamination.
- Perform plasma desmear or chemical cleaning to prepare via holes.
- Lamination:
- Ensure uniform heat and pressure distribution during lamination.
- Use compatible prepregs for multilayer configurations.
- Etching:
- Standard copper etching processes are suitable.
- Maintain tight control over line width and spacing for high-frequency performance.
- Soldering:
- Compatible with lead-free and high-temperature soldering profiles.
- Ensure controlled reflow processes to avoid material degradation.
Advantages over Competitors
- Higher Dk:
- Enables miniaturization of RF components and increased circuit density.
- Thermal Management:
- Superior thermal conductivity reduces the risk of overheating in high-power designs.
- Processing Compatibility:
- Seamless integration into existing manufacturing workflows with no additional equipment required.
- Reliability:
- High Tg and low moisture absorption ensure long-term stability under various environmental conditions.
RO4360G2™ laminates provide a superior solution for high-frequency designs requiring high Dk, low loss, and robust thermal management. With excellent mechanical and electrical properties, these laminates are ideal for next-generation RF and microwave applications.
