Rogers RO4000® laminates, when combined with TICER® TCR Thin Film Resistor Foils, offer a unique solution for high-frequency applications requiring integrated resistive elements. These laminates provide exceptional electrical, thermal, and mechanical performance, while the integrated thin-film resistive layers simplify circuit design and reduce manufacturing complexity.

Key Features and Benefits

Feature	Benefit
Integrated Resistive Foils	Enables compact designs by integrating resistors directly into the PCB.
Consistent Dielectric Properties	Stable Dk and Df across a wide frequency range ensure predictable electrical performance.
High Thermal Stability	Supports thermal cycling and high-power applications with minimal performance degradation.
Low Loss Characteristics	Maintains signal integrity in RF and microwave circuits.
Manufacturing Cost Efficiency	Eliminates the need for discrete resistors, simplifying assembly and reducing costs.

TICER® TCR Thin Film Resistor Foils

TICER® TCR Thin Film Resistor Foils are thin metal layers applied to the RO4000® laminates. They are precision-engineered to provide stable resistance values with minimal variation.

Property	Value
Sheet Resistance	25, 50, or 100 Ω/□
Temperature Coefficient	±100 ppm/°C
Resistor Stability	Excellent long-term stability.
Foil Thickness	1/3 oz, 1/2 oz, or 1 oz copper options.

Applications

Industry	Examples of Use
Telecommunications	Power dividers, couplers, and attenuators in base stations.
Aerospace and Defense	Phased array antennas, radar systems, and microwave circuits.
Automotive	Advanced Driver Assistance Systems (ADAS) and automotive radar sensors.
Consumer Electronics	High-speed digital and RF circuits requiring integrated resistive components.

Processing Guidelines

Material Preparation

• Pre-bake laminates at 250°F (121°C) for 1–2 hours to remove moisture.
• Handle with care to prevent contamination of the resistive foil surface.

Etching and Resistor Definition

• Use standard photolithographic processes to define resistors.
• Protect the resistive layer during copper etching to prevent damage.

Plating

• Compatible with typical electroless and electrolytic copper plating processes.

Lamination

• Use pressures of 200–300 PSI (14–21 bar) and lamination temperatures between 375°F and 425°F (190–218°C).

Resistor Trimming

• Laser trimming or chemical trimming can be used for precision resistor adjustment.

Advantages of Combining RO4000® Laminates with TICER® TCR Foils

1. Design Flexibility:
   Enables compact, high-density designs by integrating resistors directly into the laminate.
2. Performance Optimization:
   Reduces parasitic effects associated with discrete resistors, improving high-frequency performance.
3. Cost and Time Savings:
   Simplifies assembly by eliminating discrete resistors, reducing overall manufacturing time and costs.
4. Reliability:
   Enhances the reliability of circuits, particularly in environments with significant thermal cycling or vibration.