The integration of RO4000® Series Laminates with TICER® TCR Thin Film Resistor Foils offers a streamlined solution for manufacturing high-performance RF, microwave, and mixed-signal circuits. This combination provides excellent electrical and thermal stability while supporting embedded resistive elements for advanced circuit designs.

1. Product Overview

Laminate Type	RO4003C™	RO4350B™
Material Composition	Glass-reinforced hydrocarbon/ceramic	Glass-reinforced hydrocarbon/ceramic
Resistor Foil Type	TICER® TCR Thin Film Resistors	TICER® TCR Thin Film Resistors
Key Feature	Embedded resistive elements for compact design	Enhanced thermal performance and precision

2. Key Benefits

1. Compact Circuit Design: Embedding resistors reduces the need for discrete components, saving board space.
2. High Frequency Performance: Low loss and stable dielectric properties ensure reliable operation in RF and microwave applications.
3. Thermal Stability: Excellent heat dissipation and low thermal expansion support robust designs under thermal cycling.
4. Simplified Fabrication: Compatible with conventional PCB processing techniques.

3. TICER® TCR Thin Film Resistor Foil Properties

Property	Value
Resistor Tolerance	±10%
Sheet Resistivity	10 Ω/sq, 25 Ω/sq, or 50 Ω/sq
Temperature Coefficient of Resistance (TCR)	±200 ppm/°C
Maximum Operating Temperature	125°C

4. Electrical Properties of RO4000 Laminates with TICER Foils

Parameter	RO4003C™	RO4350B™
Dielectric Constant (Dk)	3.38 ± 0.05	3.48 ± 0.05
Loss Tangent (Df)	~0.0027 @ 10 GHz	~0.0037 @ 10 GHz
Resistor Foil Tolerance	±10%	±10%

5. Applications

1. RF and Microwave Circuits: Embedded resistors simplify high-frequency circuit layouts.
2. Power Dividers and Combiners: Integrated resistive networks improve performance and reliability.
3. Impedance Matching Networks: Precise resistive elements enable optimal signal transmission.
4. Automotive Radar: High stability and performance are ideal for ADAS systems.

6. Processing Guidelines

A. Drilling

• Use carbide or diamond-coated drill bits.
• Clean vias thoroughly to prevent contamination.

B. Lamination

• Standard RO4000 lamination techniques are applicable.
• Pressure: 250–400 psi (17–28 bar).
• Temperature: 425–475°F (218–246°C).

C. Resistor Foil Etching

• Etching Process: TICER foils require an etching process compatible with their specific resistivity.
• Etchant Type: Alkaline-based etchants are preferred.

D. Solder Mask Application

• Use low-temperature solder masks to prevent damage to the resistor foils.

7. Availability

• Laminate Thickness: From 0.008” (0.203 mm) to 0.060” (1.524 mm).
• Resistor Foil Resistivities: 10 Ω/sq, 25 Ω/sq, and 50 Ω/sq.
• Panel Sizes: Standard sizes of 18” x 24” and 24” x 36”.

8. Regulatory Compliance

• RoHS and REACH Compliant: Environmentally safe and free of hazardous substances.
• UL Certification: UL 94 V-0 flame retardancy.

9. Advantages of Embedded Resistors with RO4000 Laminates

• Reduced Parasitics: Embedded resistors eliminate lead inductance and capacitance.
• Enhanced Signal Integrity: Supports high-speed and high-frequency designs.
• Cost Efficiency: Reduces the number of components and assembly steps.