Rogers RO4000® series laminates, including RO4003C™ and RO4350B™, are high-performance materials designed for RF and microwave applications. These laminates provide a cost-effective alternative to PTFE-based materials while delivering superior electrical and mechanical properties, making them ideal for high-frequency circuits in telecommunications, automotive radar, and aerospace applications.

Key Features and Benefits

Feature	RO4003C™	RO4350B™
Dielectric Constant (Dk)	3.38 ± 0.05	3.48 ± 0.05
Dissipation Factor (Df)	0.0027 @ 10 GHz	0.0037 @ 10 GHz
Thermal Conductivity	0.62 W/m·K	0.69 W/m·K
Processing Compatibility	Compatible with standard FR-4 processes	Compatible with standard FR-4 processes
Cost Efficiency	Economical for large-scale production	Slightly higher cost due to enhanced stability

Material Properties

1. Electrical Performance:
   • Both laminates provide consistent dielectric constants across a wide frequency range, ensuring predictable signal integrity.
   • Low dissipation factor minimizes signal loss, critical for high-frequency applications.
2. Mechanical Stability:
   • Both laminates exhibit excellent dimensional stability, which is essential for multilayer and precision circuit designs.
   • RO4350B offers improved mechanical robustness compared to RO4003C.
3. Thermal Performance:
   • High thermal conductivity supports better heat dissipation in high-power applications.
   • Both materials are compatible with lead-free soldering profiles.

Applications

Application	RO4003C™	RO4350B™
Antennas	Suitable for low to medium power designs	Suitable for high-power antennas
Power Amplifiers	Ideal for low-power circuits	Suitable for high-power RF circuits
Automotive Radar	Used in radar sensors and related components	Widely used in 77 GHz radar systems
Telecommunications	Base stations, filters, and couplers	High-power amplifiers, filters
Aerospace	Low-loss RF circuits	Rugged designs requiring higher mechanical strength

Fabrication Guidelines

1. Drilling and Hole Preparation:
   • Use sharp drill bits to minimize burring and delamination.
   • Perform plasma or chemical desmear to clean drilled holes.
2. Etching and Imaging:
   • Standard copper etching processes are compatible.
   • Ensure controlled etching to maintain precise line widths and spacing.
3. Multilayer Lamination:
   • Use compatible prepregs or bonding films for multilayer designs.
   • Maintain balanced stack-ups to reduce warping or bowing.
4. Soldering and Assembly:
   • Compatible with standard lead-free soldering processes.
   • Use controlled reflow profiles to avoid thermal stresses.

Comparison Between RO4003C™ and RO4350B™

Parameter	RO4003C™	RO4350B™
Processing Ease	High	High
Power Handling	Moderate	High
Mechanical Stability	Standard	Enhanced
Cost	Economical	Moderate

Rogers RO4003C™ and RO4350B™ laminates provide high-performance solutions for RF and microwave applications. With their excellent electrical properties, mechanical stability, and compatibility with standard processing techniques, these laminates deliver cost-effective solutions for industries requiring precision and reliability in high-frequency circuits.