RO3000 Series Bondply Data Sheet Processing Guidelines
Rogers RO3000® Bondply is a specialized bonding material designed for use with RO3000® series laminates in multilayer PCB constructions. This bondply delivers excellent electrical and mechanical performance, ensuring reliable and robust multilayer high-frequency circuits.
Material Overview
| Property | Value |
|---|---|
| Dielectric Constant (Dk) | 2.94 ± 0.05 |
| Dissipation Factor (Df) | 0.0013 |
| Thermal Conductivity | 0.5 W/m·K |
| Peel Strength | ≥ 6 lb/in (1.05 N/mm) |
| Glass Transition Temp (Tg) | PTFE does not have a defined TgT_gTg (stable). |
| CTE (Z-axis) | 190 ppm/°C |
| Moisture Absorption | ≤ 0.1% |
Key Features
- Low Dielectric Loss:
- Minimizes signal attenuation in high-frequency applications.
- Compatibility:
- Designed to pair seamlessly with RO3000 laminates for multilayer construction.
- Thermal Stability:
- Excellent performance in environments with significant thermal cycling.
- Ease of Processing:
- Supports standard PTFE lamination processes with straightforward handling.
Typical Applications
- Multilayer RF/microwave circuits.
- Power amplifiers and phased-array antennas.
- Satellite communication systems.
- High-speed digital applications.
Processing Guidelines
1. Lamination Process
- Preconditioning:
- Pre-bake bondply at 250∘F250^\circ \text{F}250∘F (121°C) for 2–4 hours to remove moisture.
- Press Cycle:
- Temperature: Heat up to 425∘F425^\circ \text{F}425∘F (218°C).
- Pressure: Apply 200–400 PSI200–400 \, \text{PSI}200–400PSI (14–28 bar).
- Heating Rate: 4–6∘F/min4–6^\circ \text{F}/\text{min}4–6∘F/min (2–3°C/min).
- Dwell Time: Maintain peak temperature for 60–90 minutes60–90 \, \text{minutes}60–90minutes.
- Cool Down:
- Cool at a controlled rate of <5∘F/min< 5^\circ \text{F}/\text{min}<5∘F/min (3°C/min) to room temperature.
2. Drilling and Hole Preparation
- Use carbide or diamond-coated drill bits for precision.
- Desmear using plasma or sodium etching for improved copper adhesion.
3. Surface Preparation for Plating
- Plasma treatment or sodium etching enhances metal-to-bondply adhesion.
Storage and Handling
- Storage Conditions: Store in a clean, dry environment at 20∘C20^\circ \text{C}20∘C (68°F) and 50%50\%50% relative humidity.
- Shelf Life: Use within one year of manufacturing for optimal performance.
RO3000 Series Bondply provides robust bonding performance for multilayer PCBs in high-frequency and high-reliability applications. With its low dielectric loss, thermal stability, and ease of processing, it is an ideal choice for advanced RF and microwave designs.
For further details, refer to Rogers Corporation’s technical documentation or consult their engineering support team.
