The RO3000® Series Bondply is a high-frequency adhesive material used in the lamination of RO3000® series laminates. This material provides excellent bonding strength, electrical performance, and compatibility with a variety of RF and microwave applications.

1. Product Overview

RO3000® Bondply is a ceramic-filled PTFE adhesive layer designed to laminate high-frequency circuit materials, particularly the RO3000® series laminates. It offers stable dielectric properties, low loss, and robust adhesion to meet the demands of multilayer RF designs.

2. Key Features

• Low Dielectric Loss: Maintains signal integrity in RF applications.
• Stable Dielectric Constant (Dk): Provides consistent performance across temperature and frequency ranges.
• Thermal Stability: Supports reliable performance in thermal cycling environments.
• Excellent Adhesion: Strong bond with both copper and PTFE-based laminates.
• Ease of Use: Compatible with standard PCB manufacturing and lamination processes.

3. Material Properties

Property	Typical Value
Dielectric Constant (Dk)	~2.94 ± 0.05 (at 10 GHz)
Dissipation Factor (Df)	0.0015 (at 10 GHz)
Peel Strength	≥ 7 lbs/in (1.2 N/mm)
Thermal Conductivity	0.25 W/m·K
Coefficient of Thermal Expansion (CTE), X, Y	~50 ppm/°C
Coefficient of Thermal Expansion (CTE), Z	~100 ppm/°C
Water Absorption	< 0.1%
Decomposition Temperature (Td)	> 500°C

4. Available Configurations

• Thickness: Available in 0.002” (50 µm) to 0.010” (250 µm).
• Roll or sheet formats.
• Compatible with various copper cladding options.

5. Processing Guidelines

A. Storage and Handling

• Store in a cool, dry environment (20–25°C, 30–50% RH).
• Avoid exposure to direct sunlight and contaminants.
• Use clean gloves when handling to prevent surface contamination.

B. Lamination Guidelines

• Preparation: Ensure surfaces are clean and free from debris. Plasma or chemical cleaning is recommended.
• Lamination Cycle:
  • Temperature: 200–230°C (392–446°F).
  • Pressure: 300–500 psi.
  • Time: Maintain temperature and pressure for 30–60 minutes, depending on laminate thickness.
• Cooling: Cool under pressure to avoid warping or delamination.

C. Drilling

• Use carbide or diamond-coated bits to achieve clean hole walls.
• Minimize stack height to reduce resin smear.
• Perform post-drill cleaning to ensure through-hole quality.

D. Etching and Plating

• Compatible with standard etching and plating techniques.
• Use electroless copper plating for uniform conductivity.

E. Soldering and Assembly

• Use standard reflow or vapor phase soldering methods.
• Avoid excessive mechanical stress to preserve structural integrity.

6. Applications

• Multilayer RF and microwave circuits
• Antenna arrays
• Power amplifiers
• Aerospace and satellite systems

7. Compliance and Certifications

• RoHS Compliant: Yes
• REACH Compliant: Yes
• UL Listed: UL 94 V-0 for certain configurations

8. Safety and Handling

• Wear appropriate PPE to avoid exposure to dust or fumes during processing.
• Ensure adequate ventilation in lamination and machining areas.
• Dispose of scrap material according to local regulations.