The RO3000® series laminates are ceramic-filled PTFE-based materials, designed for use in RF and microwave applications. These materials provide excellent electrical performance, thermal stability, and mechanical integrity for a wide range of high-frequency applications.

1. Product Overview

Product	Dk (Dielectric Constant)	Df (Dissipation Factor)	Applications
RO3003®	3.00 ± 0.04	0.0010 (at 10 GHz)	General RF/microwave circuits, antennas
RO3006®	6.15 ± 0.15	0.0020 (at 10 GHz)	Power amplifiers, RF filters
RO3010®	10.2 ± 0.30	0.0022 (at 10 GHz)	Compact RF components, couplers, resonators
RO3035®	3.50 ± 0.05	0.0015 (at 10 GHz)	High-performance antennas, sensitive RF designs

2. Material Properties

Property	RO3003®	RO3006®	RO3010®	RO3035®
Dielectric Constant (Dk)	3.00	6.15	10.2	3.50
Dissipation Factor (Df)	0.0010	0.0020	0.0022	0.0015
Thermal Conductivity (W/m·K)	0.50	0.80	1.20	0.60
Coefficient of Thermal Expansion (CTE), X, Y (ppm/°C)	~17	~15	~13	~20
CTE, Z-axis (ppm/°C)	~24	~20	~18	~28
Water Absorption (%)	< 0.1	< 0.1	< 0.1	< 0.1
Copper Peel Strength (lbs/in)	≥8	≥9	≥10	≥8

3. Key Features

• Low Dielectric Loss: Minimizes signal attenuation in high-frequency applications.
• Stable Dielectric Constant (Dk): Maintains performance over a wide range of frequencies and temperatures.
• Thermal Stability: Suitable for use in environments with frequent thermal cycling.
• Mechanical Robustness: Excellent dimensional stability and copper adhesion.
• Ease of Fabrication: Compatible with standard PCB manufacturing processes.

4. Available Thickness and Copper Cladding Options

Laminate Thickness	Standard Copper Weight
0.010″ to 0.060″	½ oz, 1 oz, 2 oz

5. Applications

• RF/microwave circuits
• Wireless communication devices
• Aerospace and defense systems
• Power amplifiers and antennas
• Filters, resonators, and couplers

6. Processing Guidelines

• Drilling: Use carbide or diamond-coated drill bits.
• Etching: Compatible with conventional PCB etching processes.
• Lamination: Apply recommended temperature and pressure profiles.
• Soldering: Use vapor phase or reflow soldering with controlled thermal profiles.

7. Safety and Handling

• Handle materials with gloves to avoid contamination.
• Store in a cool, dry environment (20–25°C, 30–50% RH).
• Ensure proper ventilation during machining or processing.

8. Compliance and Certifications

• RoHS Compliant: Yes
• REACH Compliant: Yes
• UL Listed: UL 94 V-0 (Certain Configurations)