PSIS – RO1200 Laminate Series
PSIS – RO1200 Laminate Series refers to advanced circuit materials from Rogers Corporation designed for high-frequency and high-speed digital applications. The RO1200 laminates are part of Rogers’ XtremeSpeed™ series, offering ultra-low loss characteristics, excellent thermal stability, and outstanding mechanical reliability.
Key Features of RO1200 Laminate Series
- Extremely Low Loss:
- Ideal for applications requiring minimal signal attenuation at high frequencies.
- High Thermal Stability:
- Supports reliable performance in environments with fluctuating or extreme temperatures.
- Excellent Electrical Properties:
- Stable dielectric constant (Dk) and low dissipation factor (Df) across a wide frequency range.
- Robust Mechanical Strength:
- Compatible with high-layer-count PCBs and complex board designs.
- RoHS Compliant:
- Environmentally friendly and compliant with global safety standards.
Applications
- Telecommunications:
- 5G infrastructure, base stations, and satellite communications.
- Aerospace & Defense:
- Radar systems and avionics requiring high-frequency operation.
- High-Speed Digital Circuits:
- Data centers, supercomputers, and other high-performance computing applications.
Fabrication Considerations
- Material Handling:
- Requires proper storage and handling to avoid contamination and damage.
- Drilling:
- Use specialized drill bits and controlled parameters to ensure hole quality.
- Lamination:
- Follow recommended lamination profiles to maintain material integrity.
- Etching:
- Use appropriate chemistries to avoid over-etching or undercutting.
Typical Properties
| Property | Value |
|---|---|
| Dielectric Constant (Dk) | ~3.05 at 10 GHz |
| Dissipation Factor (Df) | ~0.0012 at 10 GHz |
| Thermal Conductivity | ~0.5 W/mK |
| Flammability | UL94 V-0 |
| Glass Transition (Tg) | Not applicable (thermoset) |
