The XtremeSpeed™ RO1200 Bondply is an advanced, extremely low-loss, ceramic-filled, non-glass reinforced PTFE bonding material developed by Rogers Corporation. It is engineered for high-speed digital applications, offering exceptional electrical and mechanical performance.

RO1200 Bondply Key Features:

• Low Dielectric Constant (Dk): Approximately 2.99 at 10 GHz, ensuring excellent signal integrity.
• Low Dissipation Factor (Df): Approximately 0.0012 at 10 GHz, indicating minimal signal loss.
• Thermal Stability: Low Coefficient of Thermal Expansion (CTE) in the X, Y, and Z axes, contributing to outstanding thermal and mechanical performance in demanding applications.
• Thickness Options: Available in 2.5, 3.0, 4.0, and 5.0 mils, with the ability to stack plies to achieve desired thicknesses for impedance matching.
• Flammability Rating: UL94 V-0, ensuring safety in various applications.

Applications:

• Core/Edge IP Routers and Switches
• High-Performance Computing (HPC) Servers, Switching, and Storage
• Backplanes
• Automated Test Equipment (ATE)

For detailed technical specifications and processing guidelines, you can refer to the official datasheet provided by Rogers Corporation:

This datasheet offers comprehensive information on material properties, recommended processing parameters, and application suitability, assisting engineers and manufacturers in effectively utilizing RO1200™ Bondply in their high-speed digital designs.

If you have specific questions or require further assistance regarding RO1200™ Bondply, feel free to ask!