RF-60TC_datasheet
RF-60TC is an advanced thermally conductive laminate designed for RF and microwave applications that demand high power handling and efficient heat dissipation. The material features a ceramic-filled PTFE composite that provides exceptional thermal conductivity and excellent electrical performance, ensuring stable and reliable operation across a wide range of frequencies.
Key Features
- High Thermal Conductivity:
- 1.44 W/m·K, enabling effective thermal management for high-power designs.
- Stable Electrical Performance:
- Consistent dielectric constant (Dk) and ultra-low dissipation factor (Df).
- Low Moisture Absorption:
- Ensures reliable performance in humid or environmentally challenging conditions.
- Mechanical Stability:
- Excellent adhesion to copper foils and robust mechanical properties for multilayer circuit fabrication.
- Wide Operating Temperature Range:
- Designed for high-reliability applications in extreme thermal environments.
Typical Applications
- Telecommunications:
- Power amplifiers and base stations for 5G and mmWave.
- Aerospace and Defense:
- Phased array antennas and radar systems.
- Automotive:
- Advanced driver-assistance systems (ADAS) and RF sensors.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 6.15 ± 0.15 (10 GHz) |
| Dissipation Factor (Df) | ≤ 0.002 (10 GHz) |
| Thermal Conductivity | 1.44 W/m·K |
| Moisture Absorption | < 0.01% |
| Coefficient of Thermal Expansion (CTE), Z-Axis | ~25 ppm/°C |
| Peel Strength (1 oz copper) | ≥ 9 lbs/in |
| Flammability Rating | UL 94 V-0 |
| Operating Temperature Range | -40°C to +150°C |
Fabrication Guidelines
- Drilling:
- Use diamond-coated or carbide drill bits to avoid delamination.
- Maintain clean hole walls for optimal plating quality.
- Lamination:
- Apply uniform pressure and temperature for proper bonding with other layers.
- Plating:
- Compatible with standard electroless and electrolytic copper plating techniques.
- Routing:
- High-speed routers with adequate cooling recommended for precise edge finishes.
- Storage Conditions:
- Store in a controlled environment (20–25°C, 40–60% RH) to maintain material integrity.
Advantages
- Reliable high-power performance with effective heat dissipation.
- Exceptional dimensional stability for multilayer and hybrid PCB designs.
- Industry-standard process compatibility for cost-efficient manufacturing.
Compliance and Certifications
- RoHS and REACH Compliant
- UL 94 V-0 Flammability Rating
- Low Outgassing Properties
