RF-35A2 Ultra Low Loss Power Amplifier Substrate
RF-35A2 is a high-performance RF substrate engineered for power amplifier and other RF/microwave applications requiring ultra-low dielectric loss. This substrate features a ceramic-filled thermoset resin system reinforced with woven glass, designed to deliver excellent electrical and mechanical properties while maintaining cost-effectiveness.
RF-35A2 is particularly suited for applications such as base station amplifiers, satellite communication systems, and other RF systems where efficient power handling is critical.
Key Features and Benefits
- Exceptional Electrical Performance:
- Ultra-low dielectric loss ensures minimal signal attenuation.
- Stable dielectric constant across a wide frequency range, enabling consistent performance.
- High Thermal Reliability:
- Excellent heat dissipation capability supports high-power applications.
- Low Coefficient of Thermal Expansion (CTE) ensures dimensional stability and reliability.
- Mechanical Durability:
- Woven glass reinforcement provides superior mechanical strength.
- Compatible with standard PCB processing for easy manufacturability.
- Environmental Resistance:
- Low moisture absorption for stable performance in varying environmental conditions.
- UL 94 V-0 flammability rating ensures safety compliance.
Material Properties
| Property | Typical Value |
|---|---|
| Dielectric Constant (Dk) | 3.5 ± 0.05 (10 GHz) |
| Dissipation Factor (Df) | 0.0018 (10 GHz) |
| Thermal Conductivity | 0.70 W/m·K |
| CTE (Z-Axis) | ~25 ppm/°C |
| Moisture Absorption | < 0.02% |
| Flammability Rating | UL 94 V-0 |
| Copper Peel Strength | ≥9 lbs/in (1 oz copper) |
Applications
- Telecommunications:
- Base station power amplifiers.
- 5G and millimeter-wave systems.
- Aerospace and Defense:
- High-power RF amplifiers.
- Satellite communication systems.
- Industrial:
- RF heating and drying systems.
Fabrication Guidelines
- Drilling:
- Use carbide or diamond-coated drill bits to prevent damage to the substrate.
- Ensure proper chip evacuation to avoid clogging.
- Lamination:
- Uniform pressure and temperature during lamination for optimal bonding.
- Copper Plating:
- Compatible with standard electroless and electrolytic plating processes.
- Storage Recommendations:
- Store in a clean, dry environment with stable temperature and humidity.
Compliance and Certifications
- RoHS Compliant
- REACH Compliant
- UL 94 V-0 Flammability Certification
