TMM® laminates are high-performance thermoset, ceramic-filled polymer composites designed for microwave and RF applications. These materials require specific processing techniques to achieve optimal performance and preserve their unique properties.

Material Handling

1. Storage:
   • Store laminates in a clean, dry environment.
   • Maintain ambient temperature at 20–25°C (68–77°F) with relative humidity below 50%.
   • Avoid prolonged exposure to direct sunlight or high humidity.
2. Cleaning:
   • Use isopropyl alcohol (IPA) or a mild detergent to clean surfaces before processing.
   • Ensure materials are free from dust, grease, and other contaminants.

Drilling Guidelines

1. Drill Bit Selection:
   • Use carbide or diamond-coated drills.
   • Recommended drill diameter tolerance: ±0.05 mm (±0.002 inches).
2. Drilling Parameters:
   • Spindle Speed: 30,000–60,000 RPM.
   • Feed Rate: 50–150 inches per minute (IPM).
   • Retract Rate: 500 IPM to reduce burr formation.
3. Stack Configuration:
   • Use aluminum or phenolic entry/exit materials to minimize burring and delamination.
   • Limit stack height to 4–6 panels for consistency.

Routing Guidelines

1. Tool Selection:
   • Use single-flute carbide or diamond-coated router bits.
2. Routing Parameters:
   • Spindle Speed: 20,000–40,000 RPM.
   • Feed Rate: 50–100 IPM.
3. Cooling:
   • Apply compressed air to prevent overheating and reduce dust accumulation.

Lamination Guidelines

1. Press Cycle:
   • Preheat: Heat stack to 120°C (248°F) at 1.5°C per second.
   • Cure: Hold at 220°C (428°F) for 60 minutes.
   • Cool: Allow a controlled cooldown to avoid warping.
2. Pressure:
   • Apply 200–300 psi during the lamination cycle.
3. Alignment:
   • Use pin registration or mechanical stops for layer alignment.

Plating and Metallization

1. Preparation:
   • Perform a micro-etch process to ensure adhesion.
2. Electroless Plating:
   • Ensure solution temperature and chemical composition are consistent with TMM® laminate compatibility.
3. Electrolytic Plating:
   • Use standard copper electroplating processes. Monitor thickness for uniformity.

Common Challenges and Solutions

Issue	Cause	Solution
Delamination	Excessive heat or pressure	Optimize lamination cycle parameters.
Burring in Drilling	Dull drill bits or improper stack setup	Use sharp tools and proper stack materials.
Warping	Uneven cooling or pressure distribution	Use a controlled cooling process.

Best Practices

1. Tool Maintenance:
   • Regularly inspect and replace worn tools to ensure clean cuts and consistent quality.
2. Panel Orientation:
   • Align layers accurately to minimize stress and preserve signal integrity.
3. Dust Management:
   • Use a vacuum system during drilling and routing to remove ceramic dust.