Material Overview

RO4360G2™ laminates are high-frequency materials with a dielectric constant (Dk) of 6.15 ± 0.15, designed for RF, microwave, and high-power applications. They are compatible with FR-4 processing methods, offering a cost-effective and efficient manufacturing process.

Drilling

• Drill Bits: Use carbide drill bits optimized for ceramic-filled materials.
• Parameters:
  • Speed: 150,000–200,000 RPM
  • Feed Rate: 2–3 mil/rev
  • Retract Rate: 500–600 IPM
• Hole Cleaning:
  • Perform plasma desmear or chemical cleaning to ensure debris-free and smooth hole walls.

Lamination

• Prepregs: Use RO4450F™ prepreg for multilayer builds to ensure compatibility.
• Parameters:
  • Pressure: 200–400 psi
  • Temperature: 425–450°F (220–230°C)
  • Dwell Time: 60 minutes at peak temperature
• Maintain even pressure distribution to avoid warping or delamination.

Etching

• Use standard copper etching processes.
• Maintain tight process controls to ensure accurate line widths and spacing, especially critical for high-frequency designs.

Solder Mask Application

• Preparation: Thoroughly clean the surface to remove contaminants.
• Mask Type: Select solder masks compatible with high-frequency laminates for best adhesion and performance.

Soldering

• Compatibility: Supports lead-free and traditional soldering processes.
• Reflow Profile: Use controlled profiles to avoid exceeding the glass transition temperature (Tg) of the laminate (>280°C).

Surface Finishes

RO4360G2 laminates are compatible with various finishes, including:

• Electroless Nickel Immersion Gold (ENIG)
• Immersion Silver or Tin
• Organic Solderability Preservative (OSP)

Thermal Management

• Thermal Conductivity: 0.8 W/m·K
• Considerations:
  • Use thermal vias or heat sinks for high-power designs to enhance heat dissipation.

Storage and Handling

• Storage Conditions: Store laminates in a cool, dry environment to prevent moisture absorption.
• Handling Precautions: Avoid bending or flexing to prevent mechanical damage or cracking.

Applications

• RF Power Amplifiers
• Microwave Circuits
• Automotive Radar Systems
• High-Frequency Filters

Best Practices

1. Test processes on sample boards before full-scale production.
2. Use precision tools and equipment to maintain dimensional accuracy.
3. Validate process parameters to ensure optimal performance and reliability.