These high-performance laminates from the RO4000® Series are designed for ease of fabrication using standard PCB manufacturing techniques. Follow these guidelines to ensure optimal performance and reliability.

1. Material Overview

Property	RO4003C™	RO4350B™	RO4835™
Dielectric Constant (Dk)	~3.38 @ 10 GHz	~3.48 @ 10 GHz	~3.48 @ 10 GHz
Loss Tangent (Df)	~0.0027	~0.0037	~0.0033
Thermal Stability	Moderate	High	Very High
Oxidation Resistance	Standard	Enhanced	Superior

2. Drilling

Proper drilling techniques ensure high-quality vias and minimize defects.

• Drill Type: Carbide or polycrystalline diamond-coated drills.
• Spindle Speed: 30,000–60,000 RPM, depending on hole size.
• Feed Rate: 75–125 IPM (1.9–3.2 m/min).
• Entry and Exit Materials: Use aluminum entry sheets and phenolic backer boards to minimize burrs.
• Cleaning: Remove resin smear with plasma or chemical desmear.

3. Lamination

Multi-layer PCB designs with RO4000 laminates require precise lamination processes.

• Prepreg Compatibility: Use Rogers RO4450B™ prepreg for bonding.
• Lamination Pressure: 250–400 psi (17–28 bar).
• Lamination Temperature: 425–475°F (218–246°C).
• Heating Rate: 3–5°F/min (1.7–2.8°C/min) to avoid voids.
• Cooling Rate: ≤6°F/min (≤3.3°C/min) under pressure to prevent delamination.

4. Copper Etching

Standard PCB etching processes are compatible with RO4000 laminates.

• Etchant: Alkaline or acid-based etchants work well.
• Etch Rate: Maintain uniform etch rates to minimize undercutting.
• Surface Preparation: Use micro-etching to enhance copper adhesion.

5. Plating and Metallization

Reliable metallization ensures strong and conductive vias.

• Through-Hole Plating: Electroless copper followed by electrolytic copper plating.
• Copper Thickness: Minimum of 25 µm (1 mil) in through-holes.
• Surface Cleaning: Ensure thorough cleaning to avoid contamination.

6. Solder Mask Application

• Compatibility: Use a solder mask compatible with RO4000 laminates’ surface energy.
• Surface Prep: Clean and micro-etch for improved adhesion.
• Curing: Follow solder mask manufacturer’s curing recommendations.

7. Thermal Management

RO4000 laminates offer good thermal stability but require proper thermal handling.

• Preheat During Soldering: Avoid thermal shock by preheating to ~125°C (257°F).
• Lead-Free Soldering: Compatible with lead-free soldering temperatures.
• Cooling: Controlled cooling minimizes warping or cracking.

8. Routing and Profiling

• Routing Method: Use carbide tools or laser cutting for edge profiling.
• Tool Speed: 20,000–40,000 RPM.
• Final Finishing: De-burr edges to ensure smooth and accurate profiling.

9. Storage and Handling

• Storage Environment:
  • Temperature: 23°C (73°F).
  • Humidity: 50%.
• Handling Precautions: Wear gloves to avoid contamination. Store flat to prevent mechanical stress.

10. Key Processing Tips

• Perform a test run to validate process parameters.
• Use Rogers-recommended prepregs and adhesives for best results.
• Regularly inspect tooling for wear to maintain precision.
• Ensure proper ventilation when cutting or drilling to manage dust and debris.