1. Material Overview

RO3000® and RO3200® series laminates are ceramic-filled PTFE-based materials designed for RF and microwave circuit applications. These laminates offer excellent dielectric stability, low loss, and mechanical robustness, making them ideal for a wide range of high-frequency designs.

2. Key Material Properties

Property	RO3000® Series	RO3200® Series
Dielectric Constant (Dk)	3.00–10.2	6.15–10.2
Loss Tangent (Df)	0.0010–0.0022	0.0018–0.0025
Coefficient of Thermal Expansion (CTE): X, Y	~17 ppm/°C	~22 ppm/°C
Thermal Conductivity	0.50 W/m·K	0.45 W/m·K

3. Storage Recommendations

• Store materials flat in a cool, dry environment (20–25°C, 30–50% RH).
• Avoid exposure to direct sunlight or UV light.
• Handle with gloves to prevent contamination.

4. Drilling Guidelines

• Drill Bit Type: Use carbide or diamond-coated drill bits for optimal hole quality.
• Drilling Parameters:
  • Spindle speed: 30,000–100,000 RPM.
  • Feed rate: 1.5–3 mils/rev depending on material thickness.
• Stack Height: Single or small stacks recommended to reduce resin smearing.
• Deburring: Perform light deburring to maintain integrity.

5. Lamination Process

• Use prepreg or bonding films that match the thermal expansion properties of the laminates.
• Press Cycle Parameters:
  • Temperature: 200–230°C (392–446°F).
  • Pressure: 200–300 psi.
  • Time: Minimum of 30 minutes under full pressure.
• Cool under pressure to prevent warping or delamination.

6. Etching and Patterning

• Use conventional PCB etching techniques; maintain consistency in copper thickness.
• For fine-line features, inspect patterns with automated optical inspection (AOI) equipment.

7. Plating Recommendations

• Perform thorough surface preparation, including mechanical or plasma cleaning.
• Apply electroless copper plating to ensure uniform conductivity.
• Avoid high-temperature plating processes to maintain dimensional stability.

8. Soldering and Assembly

• Soldering Techniques: Use vapor phase or reflow soldering at controlled temperatures.
• Component Placement: Ensure precision placement using automated systems.
• Avoid excessive mechanical stress during assembly to maintain material integrity.

9. Testing and Inspection

• Test for dielectric constant (Dk) and loss tangent (Df) to ensure design performance.
• Verify copper adhesion, via quality, and circuit dimensional accuracy.
• Conduct RF testing to validate electrical performance.

10. Safety and Handling Precautions

• Wear PPE during processing to protect from dust and fumes.
• Ensure proper ventilation in fabrication and assembly areas.
• Dispose of scrap material in compliance with local regulations.