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PCB Material Specification Sheet
ROGERS

Quick Reference Processing Guidelines CLTE Series Laminates

CLTE Series laminates are high-frequency materials designed for precision and reliability in RF, microwave, and millimeter-wave applications. Follow these quick reference guidelines to optimize fabrication and achieve high-quality results.

Storage and Handling

  1. Storage Environment
    • Store laminates flat in a clean, dry area.
    • Maintain temperatures between 20–25°C (68–77°F) with relative humidity below 50%.
  2. Handling Precautions
    • Use clean gloves to prevent contamination.
    • Avoid bending or creasing laminates to prevent cracking.

Drilling

  1. Tooling
    • Use carbide or diamond-coated drill bits for high-quality vias.
    • Match backer and entry materials to laminate hardness to reduce burrs.
  2. Parameters
    • Entry Speed: 150–180 surface feet per minute (SFM).
    • Retract Speed: 350–400 SFM.
  3. Post-Drill Cleanup
    • Deburr carefully to prevent layer delamination or material damage.

Etching

  • Standard copper etching solutions are compatible with CLTE laminates.
  • Use controlled etching to minimize undercuts and achieve consistent patterns.

Lamination

  1. Preconditioning
    • Pre-bake laminates at 150°C (302°F) for 30–60 minutes to eliminate residual moisture.
  2. Lamination Cycle
    • Temperature: 200–220°C (392–428°F).
    • Pressure: 200–300 psi.
    • Hold Time: 30–60 minutes at peak temperature.
    • Cool under pressure to avoid voids or warping.

Plating

  1. Surface Preparation
    • Clean thoroughly to remove contaminants.
    • Plasma or chemical treatments may enhance adhesion.
  2. Plating Process
    • Electroless and electrolytic copper plating methods are compatible.
    • Ensure uniform coverage for optimal electrical performance.

Routing and Cutting

  1. Tooling
    • Use CNC routers with carbide or diamond-coated bits.
    • Laser cutting is also suitable for precise edge definitions.
  2. Parameters
    • Adjust feed rates and speeds to minimize edge chipping or delamination.

Key Considerations

  • Monitor all process steps for consistency and precision.
  • Use proper tools and clean environments to ensure high yields and long-term laminate reliability.

Author

Eleanor

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